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Title: Corrosion Mitigation of Metallic and Alloy Substrates Using Nanofluids Based Coolants
Nanofluids are defined as stable colloidal suspensions of nanoparticles within solvents. Over the past thirty years, they have emerged as promising candidates for various energy applications due to their unique material properties, which often exhibit anomalous behaviors, such as enhanced thermal energy storage (TES). The thermophysical properties and transport phenomena of nanofluids, including unusual mass transfer characteristics, can be complex and differ significantly from those of the base solvents. The envisioned applications of nanofluids are diverse and include their use as cooling agents in automobiles and manufacturing plants; as heat transfer fluids (HTFs) in heat exchangers for conventional thermal power plants, nuclear power plants, and renewable energy systems like concentrated solar power (CSP) plants; as materials for enhanced thermal energy storage, either in the form of sensible heat stored in molten salt nanofluids or latent heat in phase change materials (PCMs); as surfactants for cleaning purposes; as agents for mitigating radiation; and as corrosion inhibitors. This study investigates the corrosion performance of nanofluids when applied to metallic and alloy substrates for potential applications. Electrochemical experiments were conducted to assess the corrosion response and extent in aluminum and scratched brass. To evaluate the feasibility of adding nanoparticles to coolants, aluminum and brass surfaces were exposed to 0.01 M NaCl water solutions doped with silica nanoparticles at concentrations of 0.05% and 0.1% by mass, along with sodium dodecyl benzene sulfonate (SDBS) at 0.1% by mass. The results showed that the relative corrosion performance of the nanofluids is highly sensitive to the material nature of the tested substrates. Both brass and aluminum demonstrated improved corrosion resistance upon the introduction of silica SDBS additives into the fluid. more »« less
Shahi, Pardeep; Agarwal, Sarthak; Saini, Satyam; Niazmand, Amirreza; Bansode, Pratik; Agonafer, Dereje
(, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems)
null
(Ed.)
Abstract In today’s world, most data centers have multiple racks with numerous servers in each of them. The high amount of heat dissipation has become the largest server-level cooling problem for the data centers. The higher dissipation required, the higher is the total energy required to run the data center. Although still the most widely used cooling methodology, air cooling has reached its cooling capabilities especially for High-Performance Computing data centers. Liquid-cooled servers have several advantages over their air-cooled counterparts, primarily of which are high thermal mass, lower maintenance. Nano-fluids have been used in the past for improving the thermal efficiency of traditional dielectric coolants in the power electronics and automotive industry. Nanofluids have shown great promise in improving the convective heat transfer properties of the coolants due to a proven increase in thermal conductivity and specific heat capacity. The present research investigates the thermal enhancement of the performance of de-ionized water-based dielectric coolant with Copper nanoparticles for a higher heat transfer from the server cold plates. Detailed 3-D modeling of a commercial cold plate is completed and the CFD analysis is done in a commercially available CFD code ANSYS CFX. The obtained results compare the improvement in heat transfer due to improvement in coolant properties with data available in the literature.
Shahi, Pardeep; Heydari, Ali; Hinge, Chandraprakash; Chinthaparthy, Lochan_Sai Reddy; Modi, Himanshu; Miyamura, Harold; Tradat, Mohammad; Chowdhury, Uschas; Radmard, Vahideh; Agonafer, Dereje; et al
(, American Society of Mechanical Engineers)
Abstract Due to the increasing computational demand driven by artificial intelligence, machine learning, and the Internet of Things (IoT), there has been an unprecedented growth in transistor density for high-end CPUs and GPUs. This growth has resulted in high thermal dissipation power (TDP) and high heat flux, necessitating the adoption of advanced cooling technologies to minimize thermal resistance and optimize cooling efficiency. Among these technologies, direct-to-chip cold plate-based liquid cooling has emerged as a preferred choice in electronics cooling due to its efficiency and cost-effectiveness. In this context, different types of single-phase liquid coolants, such as propylene glycol (PG), ethylene glycol (EG), DI water, treated water, and nanofluids, have been utilized in the market. These coolants, manufactured by different companies, incorporate various inhibitors and chemicals to enhance long-term performance, prevent biogrowth, and provide corrosion resistance. However, the additives used in these coolants can impact their thermal performance, even when the base coolant is the same. This paper aims to compare these coolant types and evaluate the performance of the same coolant from different vendors. The selection of coolants in this study is based on their performance, compatibility with wetted materials, reliability during extended operation, and environmental impact, following the guidelines set by ASHRAE. To conduct the experiments, a single cold plate-based benchtop setup was constructed, utilizing a thermal test vehicle (TTV), pump, reservoir, flow sensor, pressure sensors, thermocouple, data acquisition units, and heat exchanger. Each coolant was tested using a dedicated cold plate, and thorough cleaning procedures were carried out before each experiment. The experiments were conducted under consistent boundary conditions, with a TTV power of 1000 watts and varying coolant flow rates (ranging from 0.5 lpm to 2 lpm) and supply coolant temperatures (17°C, 25°C, 35°C, and 45°C), simulating warm water cooling. The thermal resistance (Rth) versus flow rate and pressure drop (ΔP) versus flow rate graphs were obtained for each coolant, and the impact of different supply coolant temperatures on pressure drop was characterized. The data collected from this study will be utilized to calculate the Total Cost of Ownership (TCO) in future research, providing insights into the impact of coolant selection at the data center level. There is limited research available on the reliability used in direct-to-chip liquid cooling, and there is currently no standardized methodology for testing their reliability. This study aims to fill this gap by focusing on the reliability of coolants, specifically propylene glycols at concentrations of 25%. To analyze the effectiveness of corrosion inhibitors in these coolants, ASTM standard D1384 apparatus, typically used for testing engine coolant corrosion inhibitors on metal samples in controlled laboratory settings, was employed. The setup involved immersing samples of wetted materials (copper, solder coated brass, brass, steel, cast iron, and cast aluminum) in separate jars containing inhibited propylene glycol solutions from different vendors. This test will determine the reliability difference between the same inhibited solutions from different vendors.
Freitas, Eduardo; Pontes, Pedro; Cautela, Ricardo; Bahadur, Vaibhav; Miranda, João; Ribeiro, Ana P.; Souza, Reinaldo R.; Oliveira, Jeferson D.; Copetti, Jacqueline B.; Lima, Rui; et al
(, Nanomaterials)
null
(Ed.)
This study addresses the combination of customized surface modification with the use of nanofluids, to infer on its potential to enhance pool-boiling heat transfer. Hydrophilic surfaces patterned with superhydrophobic regions were developed and used as surface interfaces with different nanofluids (water with gold, silver, aluminum and alumina nanoparticles), in order to evaluate the effect of the nature and concentration of the nanoparticles in bubble dynamics and consequently in heat transfer processes. The main qualitative and quantitative analysis was based on extensive post-processing of synchronized high-speed and thermographic images. To study the nucleation of a single bubble in pool boiling condition, a numerical model was also implemented. The results show an evident benefit of using biphilic patterns with well-established distances between the superhydrophobic regions. This can be observed in the resulting plot of the dissipated heat flux for a biphilic pattern with seven superhydrophobic spots, δ = 1/d and an imposed heat flux of 2132 w/m2. In this case, the dissipated heat flux is almost constant (except in the instant t* ≈ 0.9 when it reaches a peak of 2400 W/m2), whilst when using only a single superhydrophobic spot, where the heat flux dissipation reaches the maximum shortly after the detachment of the bubble, dropping continuously until a new necking phase starts. The biphilic patterns also allow a controlled bubble coalescence, which promotes fluid convection at the hydrophilic spacing between the superhydrophobic regions, which clearly contributes to cool down the surface. This effect is noticeable in the case of employing the Ag 1 wt% nanofluid, with an imposed heat flux of 2132 W/m2, where the coalescence of the drops promotes a surface cooling, identified by a temperature drop of 0.7 °C in the hydrophilic areas. Those areas have an average temperature of 101.8 °C, whilst the average temperature of the superhydrophobic spots at coalescence time is of 102.9 °C. For low concentrations as the ones used in this work, the effect of the nanofluids was observed to play a minor role. This can be observed on the slight discrepancy of the heat dissipation decay that occurred in the necking stage of the bubbles for nanofluids with the same kind of nanoparticles and different concentration. For the Au 0.1 wt% nanofluid, a heat dissipation decay of 350 W/m2 was reported, whilst for the Au 0.5 wt% nanofluid, the same decay was only of 280 W/m2. The results of the numerical model concerning velocity fields indicated a sudden acceleration at the bubble detachment, as can be qualitatively analyzed in the thermographic images obtained in this work. Additionally, the temperature fields of the analyzed region present the same tendency as the experimental results.
Derby, Melanie M.; Adams, Allison N.; Chakraborty, Partha P.; Haque, Mohammad Rejaul; Huber, Ryan A.; Morrow, Jordan A.; Riley, Gennifer A.; Ross, Molly; Stallbaumer, Emily M.; Betz, Amy R.; et al
(, Journal of Heat Transfer)
Abstract Engineering innovations—including those in heat and mass transfer—are needed to provide food, water, and power to a growing population (i.e., projected to be 9.8 × 109 by 2050) with limited resources. The interweaving of these resources is embodied in the food, energy, and water (FEW) nexus. This review paper focuses on heat and mass transfer applications which involve at least two aspects of the FEW nexus. Energy and water topics include energy extraction of natural gas hydrates and shale gas; power production (e.g., nuclear and solar); power plant cooling (e.g., wet, dry, and hybrid cooling); water desalination and purification; and building energy/water use, including heating, ventilation, air conditioning, and refrigeration technology. Subsequently, this review considers agricultural thermal fluids applications, such as the food and water nexus (e.g., evapotranspiration and evaporation) and the FEW nexus (e.g., greenhouses and food storage, including granaries and freezing/drying). As part of this review, over 100 review papers on thermal and fluid topics relevant to the FEW nexus were tabulated and over 350 research journal articles were discussed. Each section discusses previous research and highlights future opportunities regarding heat and mass transfer research. Several cross-cutting themes emerged from the literature and represent future directions for thermal fluids research: the need for fundamental, thermal fluids knowledge; scaling up from the laboratory to large-scale, integrated systems; increasing economic viability; and increasing efficiency when utilizing resources, especially using waste products.
Singh, Manish; Ramasubramanian, Lakshmi Narayanan; Singh, Raj N
(, Journal of Vacuum Science & Technology B)
There is a growing need for digital and power electronics to deliver higher power for applications in batteries for electric vehicles, energy sources from wind and solar, data centers, and microwave devices. The higher power also generates more heat, which requires better thermal management. Diamond thin films and substrates are attractive for thermal management applications in power electronics because of their high thermal conductivity. However, deposition of diamond by microwave plasma enhanced chemical vapor deposition (MPECVD) requires high temperatures, which can degrade metallization used in power electronic devices. In this research, titanium (Ti)–aluminum (Al) thin films were deposited by DC magnetron sputtering on p-type Si (100) substrates using a physical mask for creating dot patterns for measuring the properties of the contact metallization. The influence of processing conditions and postdeposition annealing in argon (Ar) and hydrogen (H2) at 380 °C for 1 h on the properties of the contact metallization is studied by measuring the I-V characteristics and Hall effect. The results indicated a nonlinear response for the as-deposited films and linear ohmic contact resistance after postannealing treatments. In addition, the results on contact resistance, resistivity, carrier concentration, and Hall mobility of wafers extracted from Ti–Al metal contact to Si (100) are presented and discussed.
Bhattacharya, Ritwik, Banerjee, Debjyoti, and Nisar, Syed Anas. Corrosion Mitigation of Metallic and Alloy Substrates Using Nanofluids Based Coolants. Retrieved from https://par.nsf.gov/biblio/10654764. Web. doi:10.1115/HT2025-156914.
Bhattacharya, Ritwik, Banerjee, Debjyoti, & Nisar, Syed Anas. Corrosion Mitigation of Metallic and Alloy Substrates Using Nanofluids Based Coolants. Retrieved from https://par.nsf.gov/biblio/10654764. https://doi.org/10.1115/HT2025-156914
Bhattacharya, Ritwik, Banerjee, Debjyoti, and Nisar, Syed Anas.
"Corrosion Mitigation of Metallic and Alloy Substrates Using Nanofluids Based Coolants". Country unknown/Code not available: American Society of Mechanical Engineers. https://doi.org/10.1115/HT2025-156914.https://par.nsf.gov/biblio/10654764.
@article{osti_10654764,
place = {Country unknown/Code not available},
title = {Corrosion Mitigation of Metallic and Alloy Substrates Using Nanofluids Based Coolants},
url = {https://par.nsf.gov/biblio/10654764},
DOI = {10.1115/HT2025-156914},
abstractNote = {Nanofluids are defined as stable colloidal suspensions of nanoparticles within solvents. Over the past thirty years, they have emerged as promising candidates for various energy applications due to their unique material properties, which often exhibit anomalous behaviors, such as enhanced thermal energy storage (TES). The thermophysical properties and transport phenomena of nanofluids, including unusual mass transfer characteristics, can be complex and differ significantly from those of the base solvents. The envisioned applications of nanofluids are diverse and include their use as cooling agents in automobiles and manufacturing plants; as heat transfer fluids (HTFs) in heat exchangers for conventional thermal power plants, nuclear power plants, and renewable energy systems like concentrated solar power (CSP) plants; as materials for enhanced thermal energy storage, either in the form of sensible heat stored in molten salt nanofluids or latent heat in phase change materials (PCMs); as surfactants for cleaning purposes; as agents for mitigating radiation; and as corrosion inhibitors. This study investigates the corrosion performance of nanofluids when applied to metallic and alloy substrates for potential applications. Electrochemical experiments were conducted to assess the corrosion response and extent in aluminum and scratched brass. To evaluate the feasibility of adding nanoparticles to coolants, aluminum and brass surfaces were exposed to 0.01 M NaCl water solutions doped with silica nanoparticles at concentrations of 0.05% and 0.1% by mass, along with sodium dodecyl benzene sulfonate (SDBS) at 0.1% by mass. The results showed that the relative corrosion performance of the nanofluids is highly sensitive to the material nature of the tested substrates. Both brass and aluminum demonstrated improved corrosion resistance upon the introduction of silica SDBS additives into the fluid.},
journal = {},
publisher = {American Society of Mechanical Engineers},
author = {Bhattacharya, Ritwik and Banerjee, Debjyoti and Nisar, Syed Anas},
}
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