Influence of Deposition Temperature on Cu-BDC Surface-Anchored Metal–Organic Framework Formation
- Award ID(s):
- 1905221
- PAR ID:
- 10654790
- Publisher / Repository:
- American Chemical Society
- Date Published:
- Journal Name:
- The Journal of Physical Chemistry C
- Volume:
- 129
- Issue:
- 1
- ISSN:
- 1932-7447
- Page Range / eLocation ID:
- 732 to 743
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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