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Title: Ultrafast laser micromachining of through-drill trenches in silicon wafers
Award ID(s):
2047000
PAR ID:
10667565
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
Elsevier
Date Published:
Journal Name:
Manufacturing Letters
Volume:
44
Issue:
S
ISSN:
2213-8463
Page Range / eLocation ID:
746 to 751
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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