Abstract Screen printing provides a high throughput fabrication approach for flexible electronics. While PEDOT: PSS is widely adopted for the fabrication of flexible electronics due to its mechanical flexibility, electrical conductivity, and optical transparency, its intrinsic fluidic properties pose challenges for scale-up fabrication in high-performance applications. In this work, we develop a screen-printable and eco-friendly PEDOT:PSS/graphene composite ink to enable cost-effective and scalable screen printing of flexible devices. The ink formulation comprises a biodegradable binder and a green solvent without toxic surfactants, which enables a green printing process. The ink formulation is determined through comprehensive electrical and mechanical characterization to balance ink screen-printability and electrical properties. By screen-printing, the conductive PEDOT: PSS/ Graphene patterns are printed onto a wide range substrates, such as polyimide, polydimethylsiloxane, polyurethane, glass, and paper. The printed circuits demonstrate excellent flexibility, maintaining stable electrical responses over hundreds of bending cycles at a small bending radius. Using the formulated PEDOT: PSS/graphene ink, we successfully fabricate a flexible temperature sensor and flexible organic thin film transistor circuits to demonstrate its promising potential for the large-scale production of flexible wearable electronics.
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This content will become publicly available on December 1, 2026
Experimental Assessment and Data-Driven Modeling of Three-Dimensional-Printed Conductive Patterns on Electrospun Substrates
Abstract Flexible electronics (FE) have emerged as a key technology with applications in various fields, e.g., energy storage and bio-electronics. Electrospinning (ES), inkjet printing (IJP), and intense pulsed light (IPL), constitute a flexible multistage system capable to handle high customization requirements. The ES/IJP/IPL system is used for flexible substrate fabrication, conductive patterns printing, and sintering, respectively. Although the ES/IJP/IPL system seems to be suitable for on-demand FE devices manufacturing, the correlation of materials and process parameters of individual stages (i.e., ES/IJP/IPL) with the FE devices performance (i.e., conductivity) remains unexplored. Therefore, the objective of this paper is to evaluate the integration of ES, IJP, and IPL, for future production of high-performance FE devices. Various materials and process parameters are used to investigate their influence on the FE device resistivity, including different polyacrylonitrile (PAN) concentrations, voltage regimes, flow rates and the collector types in ES, and distinct number of ink layers in IJP. The study includes (1) an experimental assessment of the electrospun membrane morphology (e.g., fiber diameter) and ink coating characteristics (e.g., ink penetration) using scanning electron microscopy (SEM), and (2) a data-driven analysis through logistic regression (LR), Gaussian process (GP), and Bayesian neural network (BNN) classification models to predict FE conductive feasibility. The results indicate that membranes with larger fiber diameters benefit ink penetration, printed layer/multilayer consistency, and conductivity. This is corroborated with the classification models, where the number of printed layers, fiber diameter, and collector type, are identified as significant factors for accurately predicting conductive patterns feasibility.
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- Award ID(s):
- 2347497
- PAR ID:
- 10670822
- Publisher / Repository:
- The American Society of Mechanical Engineers
- Date Published:
- Journal Name:
- Journal of Micro and Nano Science and Engineering
- Volume:
- 13
- Issue:
- 4
- ISSN:
- 2994-7316
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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