Assessing the cybersecurity of connected 3D printers using large language models (LLMs)
- PAR ID:
- 10685245
- Publisher / Repository:
- Elsevier
- Date Published:
- Journal Name:
- Manufacturing Letters
- Volume:
- 44
- Issue:
- S
- ISSN:
- 2213-8463
- Page Range / eLocation ID:
- 1187 to 1197
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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