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Title: Assessing the cybersecurity of connected 3D printers using large language models (LLMs)
Award ID(s):
2347623 2053760 2323716
PAR ID:
10685245
Author(s) / Creator(s):
; ; ; ;
Publisher / Repository:
Elsevier
Date Published:
Journal Name:
Manufacturing Letters
Volume:
44
Issue:
S
ISSN:
2213-8463
Page Range / eLocation ID:
1187 to 1197
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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