%AWarzoha, Ronald%AWilson, Adam/A%ADonovan, Brian%ADonmezer, Nazli%AGiri, Ashutosh%AHopkins, Patrick%AChoi, Sukwon%APahinkar, Darshan%AShi, Jingjing%AGraham, Samuel%ATian, Zhiting%ARuppalt, Laura%Anull Ed.%BJournal Name: Journal of Electronic Packaging %D2020%I %JJournal Name: Journal of Electronic Packaging %K %MOSTI ID: 10207174 %PMedium: X %TApplications and Impacts of Nanoscale Thermal Transport in Electronics Packaging %XAbstract This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices. This includes those mechanisms that impact thermal transport through: (1) substrates, (2) interfaces and 2-D materials and (3) heat spreading materials. For each material layer, we provide examples of recent works that (1) demonstrate improvements in thermal performance and/or (2) improve our understanding of the relevance of nanoscale thermal transport across material junctions. We end our discussion by highlighting several additional applications that have benefited from a consideration of nanoscale thermal transport phenomena, including RF electronics and neuromorphic computing. %0Journal Article