%ADaeumer, Matthias%ASandova, Ernesto%AAzizi, Arad%ABagheri, Morteza%ABae, In-Tae%APanta, Sitaram%AKoulakova, Ekaterina%ACotts, Eric%AArvin, Charles%AKolmogorov, Aleksey%ASchiffres, Scott%BJournal Name: Acta materialia; Journal Volume: 227
%D2022%I
%JJournal Name: Acta materialia; Journal Volume: 227
%K
%MOSTI ID: 10319875
%PMedium: X
%TOrientation-dependent transport properties of Cu3Sn
%XCu3Sn, a well-known intermetallic compound with a high melting temperature and thermal stability, has found numerous applications in microelectronics, 3D printing, and catalysis. However, the relationship between the material's thermal conductivity anisotropy and its complex anti-phase boundary superstructure is not well understood. Here, frequency domain thermoreflectance was used to map the thermal conductivity variation across the surface of arc-melted polycrystalline Cu3Sn. Complementary electron backscatter diffraction and transmission electron microscopy revealed the thermal conductivity in the principal a, b, and c orientations to be 57.6, 58.9, and 67.2 W/m-K, respectively. Density functional theory calculations for several Cu3Sn superstructures helped examine thermodynamic stability factors and evaluate the direction-resolved electron transport properties in the relaxation time approximation. The analysis of computed temperature- and composition-dependent free energies suggests metastability of the known long-period Cu3Sn superstructures while the transport calculations indicate a small directional variation in the thermal conductivity. The ∼15% anisotropy measured and computed in this study is well below previously reported experimental values for samples grown by liquid-phase electroepitaxy.
%0Journal Article