Journal ArticleAccelerated Degradation Of Copper Cold Plates In Direct-to-Chip Liquid Cooling in Data CentersCHINTHAPARTHY, LOCHAN_SAI_REDDY; SAINI, SATYAM; SHAHI, PARDEEP; BANSODE, PRATIK_VITHOBA; MODI, HIMANSHU_GIRISHCHANDRA; AGONAFER, DEREJEIncreasing demands for cloud-based computing and storage, the Internet of Things and machine learning-based applications have necessitated the use of more eficient cooling technologies. Direct-to-chip liquid cooling using cold plates has proven to be one of the most effective methods to dissipate the high heat luxes of modern high-power CPUs and graphics processing units (GPU). While the published literature has well-documented research on the thermal aspects of direct liquid cooling, a detailed account of reliability degradation is missing. The present investigation provides an in-depth experimental analysis of the accelerated degradation of copper cold plates used in high-power direct-to-chip liquid cooling in data centers.ASHRAE2024-02-2910537808ASHRAE journal0001-2491https://doi.org/2209751National Science Foundation