Journal ArticleA novel method for through-silicon via characterization based on diffraction fringe analysisLin, Pengfei; Lu, Kuan; Lee, ChaBumThe precision metrology of through-hole silicon via (TSV) in the semiconductor industry has remained a critical challenge as its critical dimension (CD) reduces. In this letter, we report a novel method for TSV geometric feature measurement and characterization. By illuminating a collimated infrared laser beam to the TSV and then analyzing the TSV edge-induced diffraction interferometric fringe patterns, multiple geometric information of the TSV could be characterized, establishing its database. This computational approach to TSV characterization was validated by experiments. Being non-destructive and easy to deploy, this method provides a low cost and high efficiency solution for TSV metrology.Ultramicroscopy2025-06-0110630562Ultramicroscopy272C1141360304-3991https://doi.org/10.1016/j.ultramic.2025.1141362426512National Science Foundation