<?xml version="1.0" encoding="UTF-8"?><rdf:RDF xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:dcq="http://purl.org/dc/terms/"><records count="1" morepages="false" start="1" end="1"><record rownumber="1"><dc:product_type>Book Chapter</dc:product_type><dc:title>High-k, Low-Loss Ceramic-Thermoplastic Composite Feedstock Filaments for Fused Deposition Modeling of Microwave and mm-Wave Devices</dc:title><dc:creator>Kosamiya, Vishvajitsinh; Wang, Jing</dc:creator><dc:corporate_author/><dc:editor/><dc:description>&lt;p&gt;Maturing of additive manufacturing (AM) techniques has increased their utilization for fabricating radio frequency (RF) and microwave devices. Solid composites used in material extrusion AM have experienced considerable expansion over the past decade, incorporating functional properties into 3D-printed objects. There are encouraging indications from AM material research that electrically efficient AM materials can be discovered. These materials would be useful for producing microwave components in the future. One of the enabling techniques for fabricating these materials is to incorporate nano/microparticles or fillers into thermoplastic material. Composite material 3D printing is a novel approach to managing materials’ microwave properties. While extrinsic qualities (effective permittivity) can be controlled by shape and porosity management, intrinsic attributes are tied to the composition of composites. Furthermore, combining various materials to increase the spectrum of available microwave characteristics is made possible by multi-material 3D printing. In this chapter, we explore different methodologies to fabricate ceramic/thermoplastic composites for fused deposition modeling (FDM) of RF and microwave devices. Analytical models for predicting effective permittivity of the composite are discussed and application examples of FDM printed RF, microwave and mm-wave devices employing composites are presented.&lt;/p&gt;</dc:description><dc:publisher>IntechOpen</dc:publisher><dc:date>2025-01-23</dc:date><dc:nsf_par_id>10635806</dc:nsf_par_id><dc:journal_name/><dc:journal_volume/><dc:journal_issue/><dc:page_range_or_elocation/><dc:issn/><dc:isbn/><dc:doi>https://doi.org/10.5772/intechopen.1008537</dc:doi><dcq:identifierAwardId>2329207</dcq:identifierAwardId><dc:subject>ceramic-thermoplastic composite, fused deposition modeling, high-k, low-loss dielectrics, dielectric constant, dielectric loss tangent</dc:subject><dc:version_number/><dc:location/><dc:rights/><dc:institution/><dc:sponsoring_org>National Science Foundation</dc:sponsoring_org></record></records></rdf:RDF>