Conference PaperCross-Topology Transfer Learning Using Bayesian Optimization for Scalable Surrogate Modeling of 3D Packaging StructuresMahmud, MS; Yang, X; Kashyap, P; Swaminathan, MIEEE Electronic Components and Technology Conference2026-05-2610669034https://doi.org/2137288; 2137283; 2137259; 2345055National Science Foundation