skip to main content

Search for: All records

Creators/Authors contains: "Honarvar, Hossein"

Note: When clicking on a Digital Object Identifier (DOI) number, you will be taken to an external site maintained by the publisher. Some full text articles may not yet be available without a charge during the embargo (administrative interval).
What is a DOI Number?

Some links on this page may take you to non-federal websites. Their policies may differ from this site.

  1. Understanding nanoscale thermal transport is critical for nano-engineered devices such as quantum sensors, thermoelectrics, and nanoelectronics. However, despite overwhelming experimental evidence for nondiffusive heat dissipation from nanoscale heat sources, the underlying mechanisms are still not understood. In this work, we show that for nanoscale heat source spacings that are below the mean free path of the dominant phonons in a substrate, close packing of the heat sources increases in-plane scattering and enhances cross-plane thermal conduction. This leads to directional channeling of thermal transport—a novel phenomenon. By using advanced atomic-level simulations to accurately access the lattice temperature and the phonon scattering and transport properties, we finally explain the counterintuitive experimental observations of enhanced cooling for close-packed heat sources. This represents a distinct fundamental behavior in materials science with far-reaching implications for electronics and future quantum devices.