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Abstract Counterfeit products pose significant economic, security, and health risks. One approach to mitigate these risks involves establishing product provenance by tracing them back to their manufacturing origins. However, current identification methods, such as barcodes and RFIDs, have limitations that make them vulnerable to counterfeiting. Similarly, nonvolatile memories, physically unclonable functions, and emerging techniques like Diamond Unclonable Security Tag and DNA fingerprinting also have their own limitations and challenges. For a traceability solution to gain widespread adoption, it must meet certain criteria, including being inexpensive, unique, immutable, easily readable, standardized, and unclonable. In this paper, we propose a solution that utilizes ultrashort pulsed lasers to create unique, unclonable, and immutable physical tags. These tags can then be read nondestructively using far-field Terahertz (THz) spectroscopy. The primary objective of this paper is to investigate the feasibility of our proposed approach. We aim to assess the ability to distinguish laser marks with varying depths, evaluate the sensitivity of THz reading to laser engraving parameters, examine the capacity to capture high-information-density marks, and explore the ability to capture subsurface tags. By addressing these aspects, our method holds the potential to serve as a universal solution for a wide range of traceability applications. 

Failure analysis of microelectronics is essential to identify the root cause of a device’s failure and prevent future failures. This process often requires removing material from the device sample to reach the region of interest, which can be done through various destructive methods, such as mechanical polishing, chemical etching, focused ion beam milling, and laser machining. Among these, laser machining offers a unique combination of speed, precision, and controllability to achieve a high-throughput, highly targeted material removal. In using lasers for processing of microelectronic samples, a much-desired capability is automated endpointing which is crucial for minimizing manual checks and improving the overall process throughput. In this paper, we propose to integrate laser-induced breakdown spectroscopy (LIBS), as a fast and high-precision material detection and process control means, into an ultrashort pulsed laser machining system, to enable vertical endpointing for sample preparation and failure analysis of microelectronics. The capabilities of the proposed system have been demonstrated through several sample processing examples.