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  1. ; ; ; ; ; ( , 2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM))
    Wireless power transmission is becoming a key technology in realizing future sensor nodes. Current approaches are based on inductive links or RF telemetry, both face limitations in achieving higher power densities. Multiferroic telemetry can address this challenge and provide a new approach for remote powering. This paper describes an integrated piezoelectric film on magnetostrictive carriers to achieve highly-efficient multiferroic functions. Various multi-layered architectures were investigated for output power performance. The multiferroic flexible stacks subsequently integrated with diode rectifier topologies and storage capacitors to generate the desired output. Results demonstrate new power telemetry opportunities with advanced material stacks with flex package integration. 
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  2. ; ; ; ; ( , 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). IEEE, 2022.)
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  3. ; ; ; ; ; ( , IEEE 16th Nanotechnology Materials and Devices Conference (NMDC). IEEE, 2021.)
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