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The electrical resistance of metal-polymer conductive inks increases as they undergo cyclic loading, posing a major challenge to their reliability as interconnect materials for flexible electronic devices. To characterize an ink’s fatigue performance, extensive electro-mechanical testing is usually performed. Phenomenological models that can accurately predict the resistance increase with cyclic loading can save time and be useful in flexible conductor design against fatigue failure. One such model was recently developed for only one composite ink type. The model is based on experiments monitoring resistance under monotonic stretch data and multiple experiments measuring the rate of increase of the resistance under different strain amplitudes and mean strains. The current work examines whether such resistance rate model could be generalized to apply for more types of composite inks. Two composite inks with different binder material, metal flake sizes and shapes, and substrate material were experimentally tested under monotonic and cyclic loading. It was found that the two new inks are also more sensitive to strain amplitude than mean strain. The resistance rate model accurately predicts early/catastrophic failure (<1000 cycles) in all inks and conservatively estimates high fatigue life for low strain amplitudes. A protocol detailing the procedures for applying the resistance model to new inks is outlined.

 

Abstract Flexible electronics often employ composite inks consisting of conductive flakes embedded in a polymer matrix to transmit electrical signal. Recently, localized necking was identified as a cause of a substantial increase in normalized resistance with applied strain thereby adversely impacting electrical performance. The current study explores two possible contributing factors for the formation of such localization—ink surface roughness and local variations in silver flake volume fraction. Uniaxial tension experiments of a DuPont 5025 type ink are used to inform a constitutive model implemented using finite element method on different substrates. Surface roughness was modeled by sinusoidal variation in ink height, whose amplitude and wavelength are informed by experimental laser profilometry scan data. Local flake fraction variations obtained from experimental measurements before applying any strain, were modeled as local variations in the elastic modulus according to an inverse rule of mixtures between the silver flake and acrylic binder material properties. The study identified that the ink height roughness is the most impactful contributor to the subsequent strain localization. The substrate elastic properties impact the number and magnitude of localization bands, with the stiffer substrate delocalizing strain and averting catastrophic crack formation seen with a more compliant substrate. The model incorporating surface roughness closely matches experimental measurements of local strain across different substrates. The study can inform designers of the adverse impact of ink surface roughness on localization and subsequent detrimental increase of the resistance.