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Vapor printing technologies are emerging as powerful tools for device fabrication due to their unique solvent‐free nature. In recent years, a few articles have been published to investigate these printing technologies for applications such as organic light‐emitting diodes (OLEDs), circuits, sensors, photodetectors, and drug screening. These printing technologies are physical vapor printing methods based on ablation, evaporation, and condensation. In this perspective, the advancement of vapor printing technologies is highlighted and introduces an additional approach enabling the chemistry of molecular precursors to be fully exploited dynamically. These additional concepts of vapor printing are introduced from the perspective of the printer's design and the development of process strategies with supporting original data. Furthermore, potential applications, challenges, and outlook are discussed. Specifically, this outlook appeals to researchers involved in nanostructured materials, semiconductors, catalysts, alloys, metals, polymers, functionally gradient materials, multi‐material structures, and additive manufacturing (AM) from academia and industries alike. 

Wire-laser directed energy deposition has emerged as a transformative technology in metal additive manufacturing, offering high material deposition efficiency and promoting a cleaner process environment compared to powder processes. This technique has gained attention across diverse industries due to its ability to expedite production and facilitate the repair or replication of valuable components. This work reviews the state-of-the-art in wire-laser directed energy deposition to gain a clear understanding of key process variables and identify challenges affecting process stability. Furthermore, this paper explores modeling and monitoring methods utilized in the literature to enhance the final quality of fabricated parts, thereby minimizing the need for repeated experiments, and reducing material waste. By reviewing existing literature, this paper contributes to advancing the current understanding of wire-laser directed energy deposition technology. It highlights the gaps in the literature while underscoring research needs in wire-laser directed energy deposition. 

Abstract This paper explores the production of an oxide dispersion strengthened (ODS) 304L stainless steel microchannel heat exchanger (HX) using a hybrid additive manufacturing process of laser powder bed fusion and inkjet printing. The study investigates the capabilities and economics of the hybrid inkjet-laser powder bed fusion (LPBF) process and evaluates the dimensional accuracy, functionality, and mechanical properties of the resulting ODS alloy. The effectiveness and pressure drop of the ODS heat exchangers produced by the hybrid LPBF tool are also determined. Results show that the inkjet-doped samples have a lower mean channel height with higher standard deviation than samples produced by LPBF alone. This is attributed to greater absorption of laser energy for the powder coated with the oxide precursor. The economic analysis shows that the hybrid process has a potential for reducing the unit cost of the heat exchanger based on cost modeling assumptions. 

Joining of Cu-based dispersion-strengthened alloys to Ni-based superalloys has garnered increased attention for liquid rocket engine applications due to the high thermal conductivity of Cu-based alloys and high temperature tensile strength of Ni-based superalloys. However, such joints can suffer from cracking when joined via liquid state processes, leading to part failure. In this work, compositions of 15–95 wt.% GRCop42 are alloyed with Inconel 625 and characterized to better understand the root cause of cracking. Results indicate a lack of miscibility between Cu-deprived and Cu-rich liquids in compositions corresponding to 30–95 wt.% GRCop42. Two distinct morphologies are observed and explained by use of CALPHAD; Cu-deprived dendrites with Cu-rich interdendritic zones at 30–50 wt.% GRCop42 and Cu-deprived spheres surrounded by a Cu-rich matrix at 60–95 wt.% GRCop42. Phase analysis reveals brittle intermetallic phases precipitate in the 60–95 wt.% GRCop42 Cu-deprived region. Three cracking mechanisms are proposed herein that provide guidance on the avoidance of defects Ni-based superalloy to Cu-based dispersion strengthened alloy joints. 

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.