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  1. A film adhesive is commonly used to form the bond line between composite or metal parts. The bond line's quality and performance can be affected by defects such as voids, impurities, agglomerations, and other structural issues found within it; in addition, defects can form due to damage or delamination. Identifying these defects is possible with non-destructive evaluation (NDE). In this paper, the joule-heating effect through carbon nanofibers (CNF) and carbon nanotubes (CNT) modified film adhesive will be used along with infrared thermography for bond line defect inspection. Due to the difference in the electrical conductivity between the modified epoxy and the defect, joule heating can cause a different temperature at the defect; thus, in theory, the defect can be viewed by infrared thermography. The percentage of carbon nanofiller in a film adhesive changes the measurement quality due to its relationship to electrical conductivity. An Acrylonitrile Butadiene Styrene (ABS) equilateral triangle defect with 30 mm sides was used inside bond line samples. These bond lines were composed of epoxy and nanofillers of CNF and CNT at various concentrations. Each concentration was evaluated individually and bonded onto two single-ply CFRP coupons. In this study, the feasibility of using carbon nanofillers of different concentrations as a medium for identifying and characterizing defects through NDE infrared thermography was investigated and validated the effectiveness of this new NDE approach. In the future, aligning nanofiller for bond lines could be a potential research direction to improve upon what this study strives to achieve. 
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