- Home
- Search Results
- Page 1 of 1
Search for: All records
-
Total Resources3
- Resource Type
-
00030
- Availability
-
30
- Author / Contributor
- Filter by Author / Creator
-
-
Arvin, Charles L. (3)
-
Schiffres, Scott N. (3)
-
Rangarajan, Srikanth (2)
-
Sammakia, Bahgat G. (2)
-
Azizi, Arad (1)
-
Azizi, Arad Azizi (1)
-
Bae, In-Tae (1)
-
Bae, Intae (1)
-
Bagheri, Morteza H. (1)
-
Chen, Xiaobo (1)
-
Cotts, Eric (1)
-
Daeumer, Matthias (1)
-
Fallahtafti, Najmeh (1)
-
Goodman, Jacob (1)
-
Gou, Feilin (1)
-
Hadad, Yaser (1)
-
Hoang, Cong H. (1)
-
Ke, Changhong (1)
-
Kolmogorov, Aleksey N. (1)
-
Koulakova, Ekaterina A. (1)
-
- Filter by Editor
-
-
& Spizer, S. M. (0)
-
& . Spizer, S. (0)
-
& Ahn, J. (0)
-
& Bateiha, S. (0)
-
& Bosch, N. (0)
-
& Brennan K. (0)
-
& Brennan, K. (0)
-
& Chen, B. (0)
-
& Chen, Bodong (0)
-
& Drown, S. (0)
-
& Ferretti, F. (0)
-
& Higgins, A. (0)
-
& J. Peters (0)
-
& Kali, Y. (0)
-
& Ruiz-Arias, P.M. (0)
-
& S. Spitzer (0)
-
& Spitzer, S. (0)
-
& Spitzer, S.M. (0)
-
(submitted - in Review for IEEE ICASSP-2024) (0)
-
- (0)
-
-
Have feedback or suggestions for a way to improve these results?
!
Note: When clicking on a Digital Object Identifier (DOI) number, you will be taken to an external site maintained by the publisher.
Some full text articles may not yet be available without a charge during the embargo (administrative interval).
What is a DOI Number?
Some links on this page may take you to non-federal websites. Their policies may differ from this site.
-
Daeumer, Matthias ; Sandova, Ernesto D. ; Azizi, Arad ; Bagheri, Morteza H. ; Bae, In-Tae ; Panta, Sitaram ; Koulakova, Ekaterina A. ; Cotts, Eric ; Arvin, Charles L. ; Kolmogorov, Aleksey N. ; et al ( , Acta materialia)Cu3Sn, a well-known intermetallic compound with a high melting temperature and thermal stability, has found numerous applications in microelectronics, 3D printing, and catalysis. However, the relationship between the material's thermal conductivity anisotropy and its complex anti-phase boundary superstructure is not well understood. Here, frequency domain thermoreflectance was used to map the thermal conductivity variation across the surface of arc-melted polycrystalline Cu3Sn. Complementary electron backscatter diffraction and transmission electron microscopy revealed the thermal conductivity in the principal a, b, and c orientations to be 57.6, 58.9, and 67.2 W/m-K, respectively. Density functional theory calculations for several Cu3Sn superstructures helped examine thermodynamic stability factors and evaluate the direction-resolved electron transport properties in the relaxation time approximation. The analysis of computed temperature- and composition-dependent free energies suggests metastability of the known long-period Cu3Sn superstructures while the transport calculations indicate a small directional variation in the thermal conductivity. The ∼15% anisotropy measured and computed in this study is well below previously reported experimental values for samples grown by liquid-phase electroepitaxy.more » « less
-
Radmard, Vahideh ; Hadad, Yaser ; Rangarajan, Srikanth ; Hoang, Cong H. ; Fallahtafti, Najmeh ; Arvin, Charles L. ; Sikka, Kamal ; Schiffres, Scott N. ; Sammakia, Bahgat G. ( , Applied Thermal Engineering)