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Understanding nanoscale thermal transport is critical for nano-engineered devices such as quantum sensors, thermoelectrics, and nanoelectronics. However, despite overwhelming experimental evidence for nondiffusive heat dissipation from nanoscale heat sources, the underlying mechanisms are still not understood. In this work, we show that for nanoscale heat source spacings that are below the mean free path of the dominant phonons in a substrate, close packing of the heat sources increases in-plane scattering and enhances cross-plane thermal conduction. This leads to directional channeling of thermal transport—a novel phenomenon. By using advanced atomic-level simulations to accurately access the lattice temperature and the phonon scattering and transport properties, we finally explain the counterintuitive experimental observations of enhanced cooling for close-packed heat sources. This represents a distinct fundamental behavior in materials science with far-reaching implications for electronics and future quantum devices.

The notion of a locally resonant metamaterial—widely applied to light and sound—has recently been introduced to heat, whereby the thermal conductivity is reduced primarily by intrinsic localized atomic vibrations rather than scattering mechanisms. This article reviews and analyzes this new emerging concept, termed nanophononic metamaterial (NPM), and contrasts it with the competing concept of a nanophononic crystal (NPC) in which thermal conductivity reduction is realized primarily via nanoscale Bragg scattering. Both the NPM and NPC core mechanisms require the presence of a sufficient level of wave behavior, which is possible when there is a relatively wide distribution of the phonon mean free path (MFP). Silicon serves as a perfect material to form NPMs and NPCs given its relatively large average phonon MFP. This offers a unique opportunity considering silicon's abundance and mature fabrication technology. It is shown in this comparative study that while both the NPM and NPC nanosystems may be rendered to serve as extreme insulators of heat, an NPM may do so without excessive reduction in the minimum feature size–which is key to keeping the electrical properties intact. This trait makes a silicon‐based NPM poised to serve as a low‐cost thermoelectric material with exceptional performance.