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  1. null (Ed.)
    This paper reports the fabrication of β-Ga 2 O 3 nanomembrane (NM) based flexible photodetectors (PDs) and the investigation of their optoelectrical properties under bending conditions. Flexible β-Ga 2 O 3 NM PDs exhibited reliable solar-blind photo-detection under bending conditions. Interestingly, a slight shifting in wavelength of the maximum solar-blind photo-current was observed under the bending condition. To investigate the reason for this peak shifting, the optical properties of β-Ga 2 O 3 NMs under different strain conditions were measured, which revealed changes in the refractive index, extinction coefficient and bandgap of strained β-Ga 2 O 3 NMs due to the presence of nano-sized cracks in the β-Ga 2 O 3 NMs. The results of a multiphysics simulation and a density-functional theory calculation for strained β-Ga 2 O 3 NMs showed that the conduction band minimum and the valence band maximum states were shifted nearly linearly with the applied uniaxial strain, which caused changes in the optical properties of the β-Ga 2 O 3 NM. We also found that nano-gaps in the β-Ga 2 O 3 NM play a crucial role in enhancing the photoresponsivity of the β-Ga 2 O 3 NM PD under bending conditions due to the secondary light absorption caused by reflected light from the nano-gap surfaces. Therefore, this research provides a viable route to realize high-performance flexible photodetectors, which are one of the indispensable components in future flexible sensor systems. 
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  2. null (Ed.)
  3. Abstract

    Silicon carbide (SiC) is a wide bandgap third‐generation semiconductor well suited for harsh environment power electronics, micro and nano electromechanical systems, and emerging quantum technology by serving as hosts for quantum states via defect centers. The chemical inertness of SiC limits viable etching techniques to plasma‐based reactive ion etching methods; however, these could have significant undesirable effects for electronic and photonic devices. This paper presents a plasma‐free, open‐circuit, photo‐induced metal‐assisted chemical etch for fabricating micro and nanoscale features without the inherent high energy ion‐related surface damage. The method presented herein utilizes above bandgap ultraviolet light, patterned noble metal (Pt), and a solution consisting of an oxidant potassium persulfate (K2S2O8) and an acid, hydrofluoric acid, to spatially define the etching morphology. The parameter space is comprehensively explored to demonstrate the controllability and versatility of this technique to produce ordered arrays of micro and nanoscale SiC structures with porous or solid sidewalls, and to elucidate the etching mechanism.

     
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