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In this work, a scalable and rapid process is developed for creating a low‐cost humidity sensor for wireless monitoring of moisture levels within packaged goods. The sensor comprises a moisture‐sensitive interdigitated capacitor connected to a planar spiral coil, forming an LC circuit whose resonant frequency is a function of environmental humidity. The sensor is fabricated on a commercially available metallized parchment paper through selective laser ablation of the laminated aluminum (Al) film on the parchment paper substrate. The laser ablation process provides a unique one‐step patterning of the conductive Al layer on the paper while simultaneously creating high surface area Al₂O₃nanoparticles within the laser‐ablated regions. The intrinsic humidity‐responsive characteristics of the laser‐induced Al₂O₃nanostructures provide the wireless sensor with a tenfold higher sensitivity to humidity than a similar LC resonant sensor prepared by conventional photolithography‐based processes on FR‐4 substrates. The frequency change of the sensor is observed to be a linear function within the range of 0−85% RH, providing an average sensitivity of −87 kHz RH⁻¹with good repeatability and stable performance. Furthermore, the employment of scalable laser fabrication processes using commercially available inexpensive materials renders these technologies viable for roll‐to‐roll manufacturing of low‐cost wireless sensors for smart packaging applications.