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Abstract Single crystal Ge is a semiconductor that has broad applications, especially in manipulation of infrared light. Diamond machining enables the efficient production of surfaces with tolerances required by the optical industry. During machining of anisotropic single crystals, the cutting direction with respect to the in-plane lattice orientation plays a fundamental role in the final quality of the surface and subsurface. In this study, on-axis face turning experiments were performed on an undoped (111)Ge wafer to investigate the effects of crystal anisotropy and feedrate on the surface and subsurface conditions. Atomic force microscopy and scanning white light interferometry were used to characterize the presence of brittle fracture on the machined surfaces and to evaluate the resultant surface roughness. Raman spectroscopy was performed to evaluate the residual stresses and lattice disorder induced by the tool during machining. Nanoindentation with Berkovich and cube corner indenter tips was performed to evaluate elastic modulus, hardness, and fracture toughness of the machined surfaces and to study their variations with feedrate and cutting direction. Post-indentation studies of selected indentations were also performed to characterize the corresponding quasi-plasticity mechanisms. It was found that an increase of feedrate produced a rotation of the resultant force imparted by the tool indicating a shift from indentation-dominant to cutting-dominant behavior. Fracture increased with the feedrate and showed a higher propensity when the cutting direction belonged to the <112¯> family. 

Abstract This article is written as a tribute to Professor Frederick Fongsun Ling 1927–2014. Single-point diamond machining, a subset of a broader class of processes characterized as ultraprecision machining, is used for the creation of surfaces and components with nanometer scale surface roughnesses, and submicrometer scale geometrical form accuracies. Its initial development centered mainly on the machining of optics for energy and defense related needs. Today, diamond machining has broad applications that include the manufacture of precision freeform optics for defense and commercial applications, the structuring of surfaces for functional performance, and the creation of molds used for the replication of a broad range of components in plastic or glass. The present work focuses on a brief review of the technology. First addressed is the state of current understanding of the mechanics that govern the process including the resulting forces, energies and the size effect, forces when cutting single crystals, and resulting cutting temperatures. Efforts to model the process are then described. The workpiece material response when cutting ductile and brittle materials is also included. Then the present state of the art in machine tools, diamond tools and tool development, various cutting configurations used, and some examples of diamond machined surfaces and components are presented. A discussion on the measurement of surface topography, geometrical form, and subsurface damage of diamond machined surfaces is also included. 

This study investigates the microstructural evolution and mechanical response of sputter-deposited amorphous silicon oxycarbide (SiOC)/crystalline Fe nanolaminates, a single layer SiOC film, and a single layer Fe film subjected to ion implantation at room temperature to obtain a maximum He concentration of 5 at. %. X-ray diffraction and transmission electron microscopy indicated no evidence of implantation-induced phase transformation or layer breakdown in the nanolaminates. Implantation resulted in the formation of He bubbles and an increase in the average size of the Fe grains in the individual Fe layers of the nanolaminates and the single layer Fe film, but the bubble density and grain size were found to be smaller in the former. By reducing the thicknesses of individual layers in the nanolaminates, bubble density and grain size were further decreased. No He bubbles were observed in the SiOC layers of the nanolaminates and the single layer SiOC film. Nanoindentation and scanning probe microscopy revealed an increase in the hardness of both single layer SiOC and Fe films after implantation. For the nanolaminates, changes in hardness were found to depend on the thicknesses of the individual layers, where reducing the layer thickness to 14 nm resulted in mitigation of implantation-induced hardening.