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In this article, the electronic band structure of a β−(AlxGa1−x)2O3 alloy system is calculated, with β−Ga2O3 as the bulk crystal. The technique of band unfolding is implemented to obtain an effective band structure for aluminum fractions varying between 12.5% and 62.5% with respect to gallium atoms. A 160-atom supercell is used to model the disordered system that is generated using the technique of special quasi-random structures, which mimics the site correlation of a truly random alloy by reducing the number of candidate structures that arise due to the large number of permutations possible for alloy occupation sites. The impact of the disorder is then evaluated on the electron effective mass and bandgap, which is calculated under the generalized gradient approximation. 

β -Gallium oxide (Ga2O3) is an extensively investigated ultrawide-bandgap semiconductor for potential applications in power electronics and radio frequency switching. The room temperature bulk electron mobility (∼200cm2V−1s−1) is comparatively low and is limited by the 30 phonon modes originating from its 10-atom primitive cell. The theoretically calculated saturation velocity in bulk is 1–2×107cms−1 (comparable to GaN) and is limited by the low field mobility. This work explores the high field electron transport (and hence the velocity saturation) in the 2DEG based on the first principles calculated parameters. A self-consistent calculation on a given heterostructure design gives the confined eigenfunctions and eigenenergies. The intrasubband and the intersubband scattering rates are calculated based on the Fermi’s golden rule considering longitudinal optical (LO) phonon–plasmon screening. The high field characteristics are extracted from the full-band Monte Carlo simulation of heterostructures at 300 K. The overall system is divided into a 2D and a 3D region mimicking the electrons in the 2DEG and the bulk, respectively. The electron transport is treated through an integrated Monte Carlo program which outputs the steady state zone population, transient dynamics, and the velocity–field curves for a few heterostructure designs. The critical field for saturation does not change significantly from bulk values, however, an improved peak velocity is calculated at a higher 2DEG density. The velocity at low 2DEG densities is impacted by the antiscreening of LO phonons which plays an important role in shaping the zone population. A comparison with the experimental measurements is also carried out and possible origins of the discrepancies with experiments is discussed.

 

In this work, we report a study of the temperature dependent pulsed current voltage and RF characterization of [Formula: see text]-(Al x Ga 1−x ) 2 O 3 /Ga 2 O 3 hetero-structure FETs (HFETs) before and after silicon nitride (Si 3 N 4 ) passivation. Under sub-microsecond pulsing, a moderate DC-RF dispersion (current collapse) is observed before passivation in gate lag measurements, while no current collapse is observed in the drain lag measurements. The dispersion in the gate lag is possibly attributed to interface traps in the gate–drain access region. DC-RF dispersion did not show any strong dependence on the pulse widths. Temperature dependent RF measurements up to 250 °C do not show degradation in the cutoff frequencies. After Si 3 N 4 deposition at 350 °C, a shift of the threshold voltage is observed which changed the DC characteristics. However, the current collapse is eliminated; at 200 ns pulse widths, a 50% higher current is observed compared to the DC at high drain voltages. No current collapse is observed even at higher temperatures. RF performance of the passivated devices does not show degradation. These results show that ex situ deposited Si 3 N 4 is a potential candidate for passivation of [Formula: see text]-(Al x Ga 1−x ) 2 O 3 /Ga 2 O 3 HFETs. 

Abstract β -Ga 2 O 3 metal–semiconductor field-effect transistors are realized with superior reverse breakdown voltages ( V BR ) and ON currents ( I DMAX ). A sandwiched SiN x dielectric field plate design is utilized that prevents etching-related damage in the active region and a deep mesa-etching was used to reduce reverse leakage. The device with L GD = 34.5 μ m exhibits an I DMAX of 56 mA mm −1 , a high I ON / I OFF ratio >10 8 and a very low reverse leakage until catastrophic breakdown at ∼4.4 kV. A power figure of merit (PFOM) of 132 MW cm −2 was calculated for a V BR of ∼4.4 kV. The reported results are the first >4 kV class Ga 2 O 3 transistors to surpass the theoretical unipolar FOM of silicon. 

This work reports the quantification of rise in channel temperature due to self-heating in two-terminal SrSnO3 thin film devices under electrical bias. Using pulsed current–voltage (I–V) measurements, thermal resistances of the thin films were determined by extracting the relationship between the channel temperature and the dissipated power. For a 26-nm-thick n-doped SrSnO3 channel with an area of 200 μm2, a thermal resistance of 260.1 ± 24.5 K mm/W was obtained. For a modest dissipated power of 0.5 W/mm, the channel temperature rose to ∼176 °C, a value which increases further at higher power levels. Electro-thermal simulations were performed which showed close agreement between the simulated and experimental I–V characteristics both in the absence and presence of self-heating. The work presented is critical for the development of perovskite-based high-power electronic devices.