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We report the structural and electronic properties of NbN/GaN junctions grown by plasma-assisted molecular beam epitaxy. High crystal-quality NbN films grown on GaN exhibit superconducting critical temperatures in excess of 10 K for thicknesses as low as 3 nm. We observe that the NbN lattice adopts the stacking sequence of the underlying GaN and that domain boundaries in the NbN thereby occur at the site of atomic steps in the GaN surface. The electronic properties of the NbN/GaN junction are characterized using Schottky barrier diodes. Current–voltage–temperature and capacitance–voltage measurements are used to determine the Schottky barrier height of the NbN/GaN junction, which we conclude is ∼1.3 eV. 

We report the use of suboxide molecular-beam epitaxy ( S-MBE) to grow β-Ga 2 O 3 at a growth rate of ∼1 µm/h with control of the silicon doping concentration from 5 × 10 16 to 10 19  cm −3 . In S-MBE, pre-oxidized gallium in the form of a molecular beam that is 99.98% Ga 2 O, i.e., gallium suboxide, is supplied. Directly supplying Ga 2 O to the growth surface bypasses the rate-limiting first step of the two-step reaction mechanism involved in the growth of β-Ga 2 O 3 by conventional MBE. As a result, a growth rate of ∼1 µm/h is readily achieved at a relatively low growth temperature ( T sub ≈ 525 °C), resulting in films with high structural perfection and smooth surfaces (rms roughness of <2 nm on ∼1 µm thick films). Silicon-containing oxide sources (SiO and SiO 2 ) producing an SiO suboxide molecular beam are used to dope the β-Ga 2 O 3 layers. Temperature-dependent Hall effect measurements on a 1 µm thick film with a mobile carrier concentration of 2.7 × 10 17  cm −3 reveal a room-temperature mobility of 124 cm 2  V −1  s −1 that increases to 627 cm 2  V −1  s −1 at 76 K; the silicon dopants are found to exhibit an activation energy of 27 meV. We also demonstrate working metal–semiconductor field-effect transistors made from these silicon-doped β-Ga 2 O 3 films grown by S-MBE at growth rates of ∼1 µm/h. 

We report the use of suboxide molecular-beam epitaxy (S-MBE) to grow β-Ga2O3 at a growth rate of ∼1 μm/h with control of the silicon doping concentration from 5 × 1016 to 1019 cm−3 . In S-MBE, pre-oxidized gallium in the form of a molecular beam that is 99.98% Ga2O, i.e., gallium suboxide, is supplied. Directly supplying Ga2O to the growth surface bypasses the rate-limiting frst step of the two-step reaction mechanism involved in the growth of β-Ga2O3 by conventional MBE. As a result, a growth rate of ∼1 μm/h is readily achieved at a relatively low growth temperature (Tsub ≈ 525 ○C), resulting in flms with high structural perfection and smooth surfaces (rms roughness of <2 nm on ∼1 μm thick flms). Silicon-containing oxide sources (SiO and SiO2) producing an SiO suboxide molecular beam are used to dope the β-Ga2O3 layers. Temperature-dependent Hall effect measurements on a 1 μm thick flm with a mobile carrier concentration of 2.7 × 1017 cm−3 reveal a room-temperature mobility of 124 cm2 V−1 s −1 that increases to 627 cm2 V −1 s−1 at 76 K; the silicon dopants are found to exhibit an activation energy of 27 meV. We also demonstrate working metal–semiconductor feld-effect transistors made from these silicon-doped β-Ga2O3 flms grown by S-MBE at growth rates of ∼1 μm/h.