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  1. Additive manufacturing (AM) is increasingly being shown as a viable technology for the fabrication of complex 3D structures. For microwave components, the combination of laser processing and AM techniques has been reported to enhance the performance and frequency limits of the devices. In this paper, a process to fabricate a 200 μm × 200 μm × 200 μm vertical interconnect that combines fused deposition modeling (FDM), micro-dispensing, and picosecond laser machining is studied. A test structure that includes two vertical transitions is designed, fabricated, and tested, as a performance benchmark. The 4 mm long structure shows a low dissipative lossmore »(2.5 dB at 45 GHz) and excellent frequency response up to mm-wave frequencies. The described structure will help to enable the fabrication of high-performance structural RF electronics.« less
  2. Direct print additive manufacturing (DPAM) is an additive manufacturing technique that combines fused deposition modeling with micro-dispensing. As a multimaterial 3D printing method it has proven to be effective for fabricating printed electronics that operate in the microwave frequency range. This paper discusses the addition of picosecond laser processing to the DPAM process, and the enhancements to high-frequency performance and design capability that are made possible. The use of laser-enhanced DPAM for 3D fabrication of transmission lines, passive components and packaging is discussed.