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Abstract Vapor printing technologies are emerging as powerful tools for device fabrication due to their unique solvent‐free nature. In recent years, a few articles have been published to investigate these printing technologies for applications such as organic light‐emitting diodes (OLEDs), circuits, sensors, photodetectors, and drug screening. These printing technologies are physical vapor printing methods based on ablation, evaporation, and condensation. In this perspective, the advancement of vapor printing technologies is highlighted and introduce an additional approach enabling the chemistry of molecular precursors to be fully exploited dynamically. These additional concepts of vapor printing are introduced from the perspective of the printer's design and the development of process strategies with supporting original data. Furthermore, potential applications, challenges, and outlook are discussed. Specifically, this outlook appeals to researchers involved in nanostructured materials, semiconductors, catalysts, alloys, metals, polymers, functionally gradient materials, multi‐material structures, and additive manufacturing (AM) from academia and industries alike. 

Microfluidics, involving chemical or physical phenomena at the submillimeter length scale under continuous flow, allows the controlled reaction, assembly, and exfoliation of nanomaterials by adjusting the momentum, heat, and mass transfer. 

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.