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Abstract Semiconducting donor–acceptor (D–A) polymers have attracted considerable attention toward the application of organic electronic and optoelectronic devices. However, a rational design rule for making semiconducting polymers with desired thermal and mechanical properties is currently lacking, which greatly limits the development of new polymers for advanced applications. Here, polydiketopyrrolopyrrole (PDPP)‐based D–A polymers with varied alkyl side‐chain lengths and backbone moieties are systematically designed, followed by investigating their thermal and thin film mechanical responses. The experimental results show a reduction in both elastic modulus and glass transition temperature (T_g) with increasing side‐chain length, which is further verified through coarse‐grained molecular dynamics simulations. Informed from experimental results, a mass‐per‐flexible bond model is developed to capture such observation through a linear correlation betweenT_gand polymer chain flexibility. Using this model, a wide range of backboneT_gover 80 °C and elastic modulus over 400 MPa can be predicted for PDPP‐based polymers. This study highlights the important role of side‐chain structure in influencing the thermomechanical performance of conjugated polymers, and provides an effective strategy to design and predictT_gand elastic modulus of future new D–A polymers. 

Degradable epoxy-amine thermosets derived from cyclic-ketal monomers offer robust performance and facile end-of-use processing, enabling recovery of diketone building blocks and pristine carbon fiber from fiber reinforced polymer composites. 

The objective of this work was to computationally predict the melting temperature and melt properties of thermosetting monomers used in aerospace applications. In this study, we applied an existing voids method by Solca. to examine four cyanate ester monomers with a wide range of melting temperatures. Voids were introduced into some simulations by removal of molecules from lattice positions to lower the free-energy barrier to melting to directly simulate the transition from a stable crystal to amorphous solid and capture the melting temperature. We validated model predictions by comparing melting temperature against previously reported literature values. Additionally, the torsion and orientational order parameters were used to examine the monomers’ freedom of motion to investigate structure–property relationships. Ultimately, the voids method provided reasonable estimates of melting temperature while the torsion and order parameter analysis provided insight into sources of the differing melt properties between the thermosetting monomers. As a whole, the results shed light on how freedom of molecular motions in the monomer melt state may affect melting temperature and can be utilized to inspire the development of thermosetting monomers with optimal monomer melt properties for demanding applications.