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Foundations for advancing wireless networks rely on the exploration of high-frequency bands ranging from 30 GHz to 300 GHz. FutureG technologies enable access to these bands with improved spectral efficiency and bandwidth. However, these trends also present significant challenges for future electronic systems. These are associated with design for higher gain and bandwidth to address higher pathlosses, interconnect losses between the transceiver and the antenna array, higher power consumption because of hardware complexity, electromagnetic interference (EMI), thermal management for higher power dissipation, limited manufacturability because of the new set of required materials, high functional density in multilayered substrates, and high production costs. Nanopackaging enables key solutions to many of these challenges by bringing advanced packaging and device materials, interfaces and package architectures to manage the complex system requirements for FutureG communications. These include nanoscale low-loss conductors, shielding structures, thermal interfaces and heat-spreaders, reconfigurable systems with tunable components, THz arrays and detectors, metasurfaces and seamless heterogeneous integration. This article reviews the key nanopackaging advances that are making FutureG communications a reality. 

Reconfigurable Intelligent Surfaces (RIS) also known as Intelligent Reflecting Surfaces (IRS) often depend upon metasurfaces. These typically comprise of a large array of passive elements that can be fabricated to modulate reflection amplitude or phase or both to create tunable functions that are independently controlled. Various RIS are developed to improve spectral efficiency through ultrawideband antennas, enhanced beamforming with higher gain and bandwidth, spatial reconfigurability, selective and adjustable isolation, and other desired features. Several approaches to tune the RIS performance are being explored. This paper reviews the primary approaches and the benefit of emerging tunable nanomaterials in achieving such RIS functions. Designs with 1-bit and 6-bit phase shifters are discussed in the first part. Various opportunities with nanomaterials and nanodevices to induce such phase shifts are discussed in the last part of the paper. 

Reconfigurable Intelligent Surfaces (RIS) also known as Intelligent Reflecting Surfaces (IRS) often depend upon metasurfaces. These typically comprise of a large array of passive elements that can be fabricated to modulate reflection amplitude or phase or both to create tunable functions that are independently controlled. Various RIS are developed to improve spectral efficiency through ultrawideband antennas, enhanced beamforming with higher gain and bandwidth, spatial reconfigurability, selective and adjustable isolation, and other desired features. Several approaches to tune the RIS performance are being explored. This paper reviews the primary approaches and the benefit of emerging tunable nanomaterials in achieving such RIS functions. Designs with 1-bit and 6-bit phase shifters are discussed in the first part. Various opportunities with nanomaterials and nanodevices to induce such phase shifts are discussed in the last part of the paper. 

Electromagnetic compatibility (EMC) is a key requirement for electronic system design. Meeting the EMC regulations becomes more challenging as the component density increases and operation frequencies spread to multiple bands. Coupling between transmission lines is a common manifestation of electromagnetic interference (EMI). In this work, we present a novel method to suppress the noise between two transmission lines by using a metamaterial (MTM) structure. This MTM design helps to mitigate the coupling between the two transmission lines where one acts as an aggressor and the other as the victim. This approach helps miniaturize the solutions such as shielding or filtering to mitigate the noise. MTM provides good protection in terms of EMI isolation, is inexpensive, and has a smaller footprint compared to traditional EMC solutions. The second part of this article studies the impact of the relative permittivity (ε r ) of the MTM structure. Changing the ε r modifies the transmission and absorption bands. Thus, that can help in modulating the operation of the MTM through appropriate designs. The MTM designs used in this work enhanced the isolation between the victim and aggressor by 1–13.5 dB across 1–5 GHz. 

Multiferroic antennas can operate at lower frequencies with smaller dimensions as they scale with the acoustic resonance wavelength of the transducer. This has specific advantages such as antenna miniaturization and operation at lower frequencies. In this paper, we investigate multiferroic antennas for dual-band operation to enable passive backscattering telemetry-based antennas and sensors. Fabrication and testing results demonstrate the dual-band operation. A 3D antenna stack concept is described to combine the antenna pair into as integrated multiband antenna. 

Wireless power transmission is becoming a key technology in realizing future sensor nodes. Current approaches are based on inductive links or RF telemetry, both face limitations in achieving higher power densities. Multiferroic telemetry can address this challenge and provide a new approach for remote powering. This paper describes an integrated piezoelectric film on magnetostrictive carriers to achieve highly-efficient multiferroic functions. Various multi-layered architectures were investigated for output power performance. The multiferroic flexible stacks subsequently integrated with diode rectifier topologies and storage capacitors to generate the desired output. Results demonstrate new power telemetry opportunities with advanced material stacks with flex package integration.