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Abstract Electrical and mechanical integration approaches are essential for emerging hybrid electronics that must robustly bond rigid electrical components with flexible circuits and substrates. However, flexible polymeric substrates and circuits cannot withstand the high temperatures used in traditional electronic processing. This constraint requires new strategies to create flexible materials that simultaneously achieve high electrical conductivity, strong adhesion, and processibility at low temperature. Here, an electrically conductive adhesive is introduced that is flexible, electrically conductive (up to 3.25×10⁵S m⁻¹) without sintering or high temperature post‐processing, and strongly adhesive to various materials common to flexible and stretchable circuits (fracture energy 350 <G_c< 700 J m⁻²). This is achieved through a multiphase soft composite consisting of an elastomeric and adhesive epoxy network with dispersed liquid metal droplets that are bridged by silver flakes, which form a flexible and conductive percolated network. These inks can be processed through masked deposition and direct ink writing at room temperature. This enables soft conductive wiring and robust integration of rigid components onto flexible substrates to create hybrid electronics for emerging applications in soft electronics, soft robotics, and multifunctional systems. 

Abstract Soft, elastically deformable composites with liquid metal (LM) droplets can enable new generations of soft electronics, robotics, and reconfigurable structures. However, techniques to control local composite microstructure, which ultimately governs material properties and performance, is lacking. Here a direct ink writing technique is developed to program the LM microstructure (i.e., shape, orientation, and connectivity) on demand throughout elastomer composites. In contrast to inks with rigid particles that have fixed shape and size, it is shown that emulsion inks with LM fillers enable in situ control of microstructure. This enables filaments, films, and 3D structures with unique LM microstructures that are generated on demand and locked in during printing. This includes smooth and discrete transitions from spherical to needle‐like droplets, curvilinear microstructures, geometrically complex embedded inclusion patterns, and connected LM networks. The printed materials are soft (modulus < 200 kPa), highly deformable (>600 % strain), and can be made locally insulating or electrically conductive using a single ink by controlling the process conditions. These capabilities are demonstrated by embedding elongated LM droplets in a soft heat sink, which rapidly dissipates heat from high‐power LEDs. These programmable microstructures can enable new composite paradigms for emerging technologies that demand mechanical compliance with multifunctional response. 

Shaping 3D objects from 2D sheets enables form and function in diverse areas from art to engineering. Here we introduce kuttsukigami, which exploits sheet-sheet adhesion to create structure. The technique allows thin sheets to be sculpted without requiring sharp folds, enabling structure in a broad range of materials for a versatile and reconfigurable thin-sheet engineering design scheme. Simple closed structures from cylindrical loops to complex shapes like the Möbius loop are constructed and modeled through the balance between deformation and adhesion. Importantly, the balance can be used to create experimental measurements of elasticity in complex morphologies. More practically, kuttsukigami is demonstrated to encapsulate objects from the kitchen to micro scales and to build on-demand logic gates through sticky electronic sheets for truly reusable, reconfigurable devices. 

Material extrusion (MEX) of soft, multifunctional composites consisting of liquid metal (LM) droplets can enable highly tailored properties for a range of applications from soft robotics to stretchable electronics. However, an understanding of how LM ink rheology and print process parameters can reconfigure LM droplet shape during MEX processing for in-situ control of properties and function is currently limited. Herein, the material (ink viscosity, and LM droplet size) and process (nozzle velocity, height from print bed, and extrusion rate) parameters are determined which control LM microstructure during MEX of these composites. The interplay and interdependence of these parameters is evaluated and nearly spherical LM droplets are transformed into highly elongated ellipsoidal shapes with an average aspect ratio of 12.4 by systematically tuning each individual parameter. Material and process relationships are established for the LM ink which show that an ink viscosity threshold should be fulfilled to program the LM microstructure from spherical to an ellipsoidal shape during MEX. Additionally, the thin oxide layer on the LM droplets is found to play a unique and critical role in the reconfiguration and retention of droplet shape. Finally, two quantitative design maps based on material and process parameters are presented to guide MEX additive manufacturing strategies for tuning liquid droplet architecture in LM-polymer inks. The insights gained from this study enable informed design of materials and manufacturing to control microstructure of emerging multifunctional soft composites.