Atomistic modeling of capillary-driven grain boundary motion in Cu-Ta alloys
- Award ID(s):
- 1663287
- PAR ID:
- 10055549
- Date Published:
- Journal Name:
- Acta Materialia
- Volume:
- 148
- Issue:
- C
- ISSN:
- 1359-6454
- Page Range / eLocation ID:
- 311 to 319
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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