Flowers, Patrick F., Reyes, Christopher, Ye, Shengrong, Kim, Myung Jun, and Wiley, Benjamin J. 3D printing electronic components and circuits with conductive thermoplastic filament. Retrieved from https://par.nsf.gov/biblio/10061973. Additive Manufacturing 18.C Web. doi:10.1016/j.addma.2017.10.002.

Flowers, Patrick F., Reyes, Christopher, Ye, Shengrong, Kim, Myung Jun, & Wiley, Benjamin J. 3D printing electronic components and circuits with conductive thermoplastic filament. Additive Manufacturing, 18 (C). Retrieved from https://par.nsf.gov/biblio/10061973. https://doi.org/10.1016/j.addma.2017.10.002

Flowers, Patrick F., Reyes, Christopher, Ye, Shengrong, Kim, Myung Jun, and Wiley, Benjamin J. "3D printing electronic components and circuits with conductive thermoplastic filament". Additive Manufacturing 18 (C). Country unknown/Code not available. https://doi.org/10.1016/j.addma.2017.10.002. https://par.nsf.gov/biblio/10061973.

@article{osti_10061973,
place = {Country unknown/Code not available}, title = {3D printing electronic components and circuits with conductive thermoplastic filament}, url = {https://par.nsf.gov/biblio/10061973}, DOI = {10.1016/j.addma.2017.10.002}, abstractNote = {}, journal = {Additive Manufacturing}, volume = {18}, number = {C}, author = {Flowers, Patrick F. and Reyes, Christopher and Ye, Shengrong and Kim, Myung Jun and Wiley, Benjamin J.}, }