Kim, Bong Hoon, Lee, Jungyup, Won, Sang Min, Xie, Zhaoqian, Chang, Jan-Kai, Yu, Yongjoon, Cho, Youn Kyoung, Jang, Hokyung, Jeong, Ji Yoon, Lee, Yechan, Ryu, Arin, Kim, Do Hoon, Lee, Kun Hyuck, Lee, Jong Yoon, Liu, Fei, Wang, Xueju, Huo, Qingze, Min, Seunghwan, Wu, Di, Ji, Bowen, Banks, Anthony, Kim, Jeonghyun, Oh, Nuri, Jin, Hyeong Min, Han, Seungyong, Kang, Daeshik, Lee, Chi Hwan, Song, Young Min, Zhang, Yihui, Huang, Yonggang, Jang, Kyung-In, and Rogers, John A. Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process. Retrieved from https://par.nsf.gov/biblio/10066245. ACS Nano 12.5 Web. doi:10.1021/acsnano.8b00180.

Kim, Bong Hoon, Lee, Jungyup, Won, Sang Min, Xie, Zhaoqian, Chang, Jan-Kai, Yu, Yongjoon, Cho, Youn Kyoung, Jang, Hokyung, Jeong, Ji Yoon, Lee, Yechan, Ryu, Arin, Kim, Do Hoon, Lee, Kun Hyuck, Lee, Jong Yoon, Liu, Fei, Wang, Xueju, Huo, Qingze, Min, Seunghwan, Wu, Di, Ji, Bowen, Banks, Anthony, Kim, Jeonghyun, Oh, Nuri, Jin, Hyeong Min, Han, Seungyong, Kang, Daeshik, Lee, Chi Hwan, Song, Young Min, Zhang, Yihui, Huang, Yonggang, Jang, Kyung-In, & Rogers, John A. Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process. ACS Nano, 12 (5). Retrieved from https://par.nsf.gov/biblio/10066245. https://doi.org/10.1021/acsnano.8b00180

Kim, Bong Hoon, Lee, Jungyup, Won, Sang Min, Xie, Zhaoqian, Chang, Jan-Kai, Yu, Yongjoon, Cho, Youn Kyoung, Jang, Hokyung, Jeong, Ji Yoon, Lee, Yechan, Ryu, Arin, Kim, Do Hoon, Lee, Kun Hyuck, Lee, Jong Yoon, Liu, Fei, Wang, Xueju, Huo, Qingze, Min, Seunghwan, Wu, Di, Ji, Bowen, Banks, Anthony, Kim, Jeonghyun, Oh, Nuri, Jin, Hyeong Min, Han, Seungyong, Kang, Daeshik, Lee, Chi Hwan, Song, Young Min, Zhang, Yihui, Huang, Yonggang, Jang, Kyung-In, and Rogers, John A. "Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process". ACS Nano 12 (5). Country unknown/Code not available. https://doi.org/10.1021/acsnano.8b00180. https://par.nsf.gov/biblio/10066245.

@article{osti_10066245,
place = {Country unknown/Code not available}, title = {Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process}, url = {https://par.nsf.gov/biblio/10066245}, DOI = {10.1021/acsnano.8b00180}, abstractNote = {}, journal = {ACS Nano}, volume = {12}, number = {5}, author = {Kim, Bong Hoon and Lee, Jungyup and Won, Sang Min and Xie, Zhaoqian and Chang, Jan-Kai and Yu, Yongjoon and Cho, Youn Kyoung and Jang, Hokyung and Jeong, Ji Yoon and Lee, Yechan and Ryu, Arin and Kim, Do Hoon and Lee, Kun Hyuck and Lee, Jong Yoon and Liu, Fei and Wang, Xueju and Huo, Qingze and Min, Seunghwan and Wu, Di and Ji, Bowen and Banks, Anthony and Kim, Jeonghyun and Oh, Nuri and Jin, Hyeong Min and Han, Seungyong and Kang, Daeshik and Lee, Chi Hwan and Song, Young Min and Zhang, Yihui and Huang, Yonggang and Jang, Kyung-In and Rogers, John A.}, }