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Injured peripheral nerves typically exhibit unsatisfactory and incomplete functional outcomes, and there are no clinically approved therapies for improving regeneration. Post‐operative electrical stimulation (ES) increases axon regrowth, but practical challenges, from the cost of extended operating room time to the risks and pitfalls associated with transcutaneous wire placement, have prevented broad clinical adoption. This study presents a possible solution in the form of advanced bioresorbable materials for a type of thin, flexible, wireless implant that provides precisely controlled ES of the injured nerve for a brief time in the immediate post‐operative period. Afterward, rapid, complete, and safe modes of bioresorption naturally and quickly eliminate all of the constituent materials in their entirety, without the need for surgical extraction. The unusually high rate of bioresorption follows from the use of a unique, bilayer enclosure that combines two distinct formulations of a biocompatible form of polyanhydride as an encapsulating structure, to accelerate the resorption of active components and confine fragments until complete resorption. Results from mouse models of tibial nerve transection with re‐anastomosis indicate that this system offers levels of performance and efficacy that match those of conventional wired stimulators, but without the need to extend the operative period or to extract the device hardware.

Advanced mechanical metamaterials with unusual thermal expansion properties represent an area of growing interest, due to their promising potential for use in a broad range of areas. In spite of previous work on metamaterials with large or ultralow coefficient of thermal expansion (CTE), achieving a broad range of CTE values with access to large thermally induced dimensional changes in structures with high filling ratios remains a key challenge. Here, design concepts and fabrication strategies for a kirigami‐inspired class of 2D hierarchical metamaterials that can effectively convert the thermal mismatch between two closely packed constituent materials into giant levels of biaxial/uniaxial thermal expansion/shrinkage are presented. At large filling ratios (>50%), these systems offer not only unprecedented negative and positive biaxial CTE (i.e., −5950 and 10 710 ppm K⁻¹), but also large biaxial thermal expansion properties (e.g., > 21% for 20 K temperature increase). Theoretical modeling of thermal deformations provides a clear understanding of the microstructure–property relationships and serves as a basis for design choices for desired CTE values. An Ashby plot of the CTE versus density serves as a quantitative comparison of the hierarchical metamaterials presented here to previously reported systems, indicating the capability for substantially enlarging the accessible range of CTE.

Self‐folding broadly refers to the assembly of 3D structures by bending, curving, and folding without the need for manual or mechanized intervention. Self‐folding is scientifically interesting because self‐folded structures, from plant leaves to gut villi to cerebral gyri, abound in nature. From an engineering perspective, self‐folding of sub‐millimeter‐sized structures addresses major hurdles in nano‐ and micro‐manufacturing. This review focuses on self‐folding using surface tension or capillary forces derived from the minimization of liquid interfacial area. Due to favorable downscaling with length, at small scales capillary forces become extremely large relative to forces that scale with volume, such as gravity or inertia, and to forces that scale with area, such as elasticity. The major demonstrated classes of capillary force assisted self‐folding are discussed. These classes include the use of rigid or soft and micro‐ or nano‐patterned precursors that are assembled using a variety of liquids such as water, molten polymers, and liquid metals. The authors outline the underlying physics and highlight important design considerations that maximize rigidity, strength, and yield of the assembled structures. They also discuss applications of capillary self‐folding structures in engineering and medicine. Finally, the authors conclude by summarizing standing challenges and describing future trends.

Recently developed methods for transforming 2D patterns of thin‐film materials into 3D mesostructures create many interesting opportunities in microsystems design. A growing area of interest is in multifunctional thermal, electrical, chemical, and optical interfaces to biological tissues, particularly 3D multicellular, millimeter‐scale constructs, such as spheroids, assembloids, and organoids. Herein, examples of 3D mechanical interfaces are presented, in which thin ribbons of parylene‐C form the basis of transparent, highly compliant frameworks that can be reversibly opened and closed to capture, envelop, and mechanically restrain fragile 3D tissues in a gentle, nondestructive manner, for precise measurements of viscoelastic properties using techniques in nanoindentation. Finite element analysis serves as a design tool to guide selection of geometries and material parameters for shape‐matching 3D architectures tailored to organoids of interest. These computational approaches also quantitate all aspects of deformations during the processes of opening and closing the structures and of forces imparted by them onto the surfaces of enclosed soft tissues. Studies of cerebral organoids by nanoindentation show effective Young's moduli in the range from 1.5 to 2.5 kPa depending on the age of the organoid. This collection of results suggests broad utility of compliant 3D mesostructures in noninvasive mechanical measurements of millimeter‐scale, soft biological tissues.

Sensitive detection of pathogens is crucial for early disease diagnosis and quarantine, which is of tremendous need in controlling severe and fatal illness epidemics such as of Ebola virus (EBOV) disease. Serology assays can detect EBOV‐specific antigens and antibodies cost‐effectively without sophisticated equipment; however, they are less sensitive than reverse transcriptase polymerase chain reaction (RT‐PCR) tests. Herein, a 3D plasmonic nanoantenna assay sensor is developed as an on‐chip immunoassay platform for ultrasensitive detection of Ebola virus (EBOV) antigens. The EBOV sensor exhibits substantial fluorescence intensity enhancement in immunoassays compared to flat gold substrate. The nanoantenna‐based biosensor successfully detects EBOV soluble glycoprotein (sGP) in human plasma down to 220 fg mL⁻¹, a significant 240 000‐fold sensitivity improvement compared to the 53 ng mL⁻¹EBOV antigen detection limit of the existing rapid EBOV immunoassay. In a mock clinical trial, the sensor detects sGP‐spiked human plasma samples at two times the limit of detection with 95.8% sensitivity. The results combined highlight the nanosensor's extraordinary capability of detecting EBOV antigen at ultralow concentration compared to existing immunoassay methods. It is a promising next‐generation bioassay platform for early‐stage disease diagnosis and pathogen detection for both public health and national security applications.

3D structures that incorporate high‐performance electronic materials and allow for remote, on‐demand 3D shape reconfiguration are of interest for applications that range from ingestible medical devices and microrobotics to tunable optoelectronics. Here, materials and design approaches are introduced for assembly of such systems via controlled mechanical buckling of 2D precursors built on shape‐memory polymer (SMP) substrates. The temporary shape fixing and recovery of SMPs, governed by thermomechanical loading, provide deterministic control over the assembly and reconfiguration processes, including a range of mechanical manipulations facilitated by the elastic and highly stretchable properties of the materials. Experimental demonstrations include 3D mesostructures of various geometries and length scales, as well as 3D aquatic platforms that can change trajectories and release small objects on demand. The results create many opportunities for advanced, programmable 3D microsystem technologies.

Conventional assembly of biosystems has relied on bottom‐up techniques, such as directed aggregation, or top‐down techniques, such as layer‐by‐layer integration, using advanced lithographic and additive manufacturing processes. However, these methods often fail to mimic the complex three dimensional (3D) microstructure of naturally occurring biomachinery, cells, and organisms regarding assembly throughput, precision, material heterogeneity, and resolution. Pop‐up, buckling, and self‐folding methods, reminiscent of paper origami, allow the high‐throughput assembly of static or reconfigurable biosystems of relevance to biosensors, biomicrofluidics, cell and tissue engineering, drug delivery, and minimally invasive surgery. The universal principle in these assembly methods is the engineering of intrinsic or extrinsic forces to cause local or global shape changes via bending, curving, or folding resulting in the final 3D structure. The forces can result from stresses that are engineered either during or applied externally after synthesis or fabrication. The methods facilitate the high‐throughput assembly of biosystems in simultaneously micro or nanopatterned and layered geometries that can be challenging if not impossible to assemble by alternate methods. The authors classify methods based on length scale and biologically relevant applications; examples of significant advances and future challenges are highlighted.

Bioresorbable electronic technologies form the basis for classes of biomedical devices that undergo complete physical and chemical dissolution after a predefined operational period, thereby eliminating the costs and risks associated with secondary surgical extraction. A continuing area of opportunity is in the development of strategies for power supply for these systems, where previous studies demonstrate some utility for biodegradable batteries, radio frequency harvesters, solar cells, and others. This paper introduces a type of bioresorbable system for wireless power transfer, in which a rotating magnet serves as the transmitter and a bioresorbable antenna as the remote receiver, with capabilities for operation at low frequencies (<200 Hz). Systematic experimental and numerical studies demonstrate several unique advantages of this system, most significantly the elimination of impedance matching and electromagnetic radiation exposure presented with the types of radio frequency energy harvesters explored previously. These results add to the portfolio of power supply options in bioresorbable electronic implants.

Origami and kirigami, the ancient techniques for making paper works of art, also provide inspiration for routes to structural platforms in engineering applications, including foldable solar panels, retractable roofs, deployable sunshields, and many others. Recent work demonstrates the utility of the methods of origami/kirigami and conceptually related schemes in cutting, folding, and buckling in the construction of devices for emerging classes of technologies, with examples in mechanical/optical metamaterials, stretchable/conformable electronics, micro/nanoscale biosensors, and large‐amplitude actuators. Specific notable progress is in the deployment of functional materials such as single‐crystal silicon, shape memory polymers, energy‐storage materials, and graphene into elaborate 3D micro and nanoscale architectures. This review highlights some of the most important developments in this field, with a focus on routes to assembly that apply across a range of length scales and with advanced materials of relevance to practical applications.

Recent progress in stretchable forms of inorganic electronic systems has established a route to new classes of devices, with particularly unique capabilities in functional biointerfaces, because of their mechanical and geometrical compatibility with human tissues and organs. A reliable approach to physically and chemically protect the electronic components and interconnects is indispensable for practical applications. Although recent reports describe various options in soft, solid encapsulation, the development of approaches that do not significantly reduce the stretchability remains an area of continued focus. Herein, a generic, soft encapsulation strategy is reported, which is applicable to a wide range of stretchable interconnect designs, including those based on two‐dimensional (2D) serpentine configurations, 2D fractal‐inspired patterns, and 3D helical configurations. This strategy forms the encapsulation while the system is in a prestrained state, in contrast to the traditional approach that involves the strain‐free configuration. A systematic comparison reveals that substantial enhancements (e.g., ≈6.0 times for 2D serpentine, ≈4.0 times for 2D fractal, and ≈2.6 times for 3D helical) in the stretchability can be achieved through use of the proposed strategy. Demonstrated applications in highly stretchable light‐emitting diodes systems that can be mounted onto complex curvilinear surfaces illustrate the general capabilities in functional device systems.