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Title: Thermal atomic layer deposition of Sn metal using SnCl 4 and a vapor phase silyl dihydropyrazine reducing agent
Award ID(s):
1704151
PAR ID:
10091418
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
Journal of Vacuum Science & Technology A
Volume:
36
Issue:
6
ISSN:
0734-2101
Page Range / eLocation ID:
06A106
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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