Polylithic Integration of 2.5D and 3D Chiplets Using Interconnect Stitching

P. Jo, T. Zhang

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Citation Details

Polylithic Integration of 2.5D and 3D Chiplets Using Interconnect Stitching

Award ID(s):: 1810081

PAR ID:: 10097835

Author(s) / Creator(s):: P. Jo, T. Zhang

Date Published:: 2019-01-01

Journal Name:: IEEE Electronic Components and Technology Conf. (ECTC)

Format(s):: Medium: X

Sponsoring Org:: National Science Foundation

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Accepted Manuscript1.0
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