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Title: Copper Interconnects: Surface State Engineering to Facilitate Specular Electron Scattering
Award ID(s):
1740271 1712752
PAR ID:
10100609
Author(s) / Creator(s):
;
Date Published:
Journal Name:
IEEE Transactions on Electron Devices
Volume:
66
Issue:
6
ISSN:
0018-9383
Page Range / eLocation ID:
2692 to 2698
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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