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  • Accepted Manuscript: An Introduction to the CLICK Approach: Leveraging Virtual Reality to Integrate the Industrial Engineering Curriculum
Title: An Introduction to the CLICK Approach: Leveraging Virtual Reality to Integrate the Industrial Engineering Curriculum
This work introduces a new approach called Connected Learning and Integrated Course Knowledge (CLICK). CLICK is intended to provide an integrative learning experience by leveraging Virtual Reality (VR) technology to help provide a theme to connect and transfer the knowledge of engendering concepts. Integrative learning is described as the process of creating connections between concepts (i.e., skill and knowledge) from different resources and experiences, linking theory and practice, and using a variation of platforms to help students’ understanding. In the CLICK approach, the integration is achieved by VR learning modules that serve as a platform for a common theme and include various challenges and exercises from multiple courses across the IE curriculum. Moreover, the modules will provide an immersive and realistic experience, which the authors hypothesize, will improve how the students relate what they learn in a classroom, to real-life experiences. The goals of the CLICK approach are to (i) provide the needed connection between courses and improve students’ learning, and (ii) provide the needed linkage between theory and practice through a realistic representation of systems using VR. This work presents the results from an initial usability test performed on one of the VR modules. The results from the usability test indicate that more » participants liked the realism of the VR module. However, there are still some areas for improvement, and future work will focus on assessing the impact of the CLICK approach on students’ learning, motivation, and preparation to be successful engineers, areas which could translate to a STEM pipeline for the future workforce. « less
Authors:
; ;
Award ID(s):
1834465
Publication Date:
NSF-PAR ID:
10100639
Journal Name:
ASEE annual conference & exposition
ISSN:
2153-5965
Sponsoring Org:
National Science Foundation
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