Wang, Biran, Arias, Kristen F., Zhang, Zimeng, Liu, Yuchen, Jiang, Zhiyuan, Sue, Hung-Jue, Currie-Gregg, Nancy, Bouslog, Stan, Pei, Zhijian, and Wang, Shiren. 3D printing of in-situ curing thermally insulated thermosets. Retrieved from https://par.nsf.gov/biblio/10101532. Manufacturing Letters 21.C Web. doi:10.1016/j.mfglet.2019.06.001.

Wang, Biran, Arias, Kristen F., Zhang, Zimeng, Liu, Yuchen, Jiang, Zhiyuan, Sue, Hung-Jue, Currie-Gregg, Nancy, Bouslog, Stan, Pei, Zhijian, & Wang, Shiren. 3D printing of in-situ curing thermally insulated thermosets. Manufacturing Letters, 21 (C). Retrieved from https://par.nsf.gov/biblio/10101532. https://doi.org/10.1016/j.mfglet.2019.06.001

Wang, Biran, Arias, Kristen F., Zhang, Zimeng, Liu, Yuchen, Jiang, Zhiyuan, Sue, Hung-Jue, Currie-Gregg, Nancy, Bouslog, Stan, Pei, Zhijian, and Wang, Shiren. "3D printing of in-situ curing thermally insulated thermosets". Manufacturing Letters 21 (C). Country unknown/Code not available. https://doi.org/10.1016/j.mfglet.2019.06.001. https://par.nsf.gov/biblio/10101532.

@article{osti_10101532,
place = {Country unknown/Code not available}, title = {3D printing of in-situ curing thermally insulated thermosets}, url = {https://par.nsf.gov/biblio/10101532}, DOI = {10.1016/j.mfglet.2019.06.001}, abstractNote = {}, journal = {Manufacturing Letters}, volume = {21}, number = {C}, author = {Wang, Biran and Arias, Kristen F. and Zhang, Zimeng and Liu, Yuchen and Jiang, Zhiyuan and Sue, Hung-Jue and Currie-Gregg, Nancy and Bouslog, Stan and Pei, Zhijian and Wang, Shiren}, }