To understand the mechanism underlying the fast, reversible, phase transformation, information about the atomic structure and defects structures in phase change materials class is key. PCMs are investigated for many applications. These devices are chalcogenide based and use self heating to quickly switch between amorphous and crystalline phases, generating orders of magnitude differences in the electrical resistivity. The main challenges with PCMs have been the large power required to heat above crystallization or melting (for melt-quench amorphization) temperatures and limited reliability due to factors such as resistance drifts of the metastable phases, void formation and elemental segregation upon cycling. Characterization of devices and their unique switching behavior result in distinct material properties affected by the atomic arrangement in the respective phase. TEM is used to study the atomic structure of the metastable crystalline phase. The aim is to correlate the microstructure with results from electrical characterization, building on R vs T measurements on various thicknesses GST thin films.
To monitor phase changes in real-time as a function of temperature, thin films are deposited directly onto Protochips carriers. The Protochips heating holders provides controlled temperature changes while imaging in the TEM. These studies can provide insights into how changes occur in the various phase transformations even though the rate of temperature change is much slower than the PCM device operation. Other critical processes such as void formation, grain evolution and the cause of resistance drift can thereby be related to changes in structure and chemistry. Materials characterization is performed using Tecnai F30 and Titan ETEM microscopes, operating at 300kV. Both the microscopes can accept the same Protochips heating holders. The K2 direct electron detector camera equipped with the ETEM allows high-speed video recording (1600 f/s) of structural changes occurring in these materials upon heating and cooling. In this presentation, we will describe the effect of heating thin films of different thickness and composition, the changes in crystallinity and grain size, and how these changes correlate with changes in the electrical properties of the films. We will emphasize that it is always important to use low-dose and/or beam blanking techniques to distinguish changes induced by the beam from those due to the heating or introduction of an electric current.
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Computational Analysis of Complex Amorphization/Crystallization Dynamics in Large Phase Change Memory Devices
Phase change memory devices become practical for non-volatile storage at small dimensions
due to reduced power and predictable device operation. In larger scale cells, devices can be
locally melted due to filament formation and liquid filaments can be retained in parts of the cell for a long time even if most or all of the cells are initially amorphized during long fall-times. The complex amorphization and crystallization dynamics make these large cells more unpredictable and enable their applications as physically unclonable functions (PUF) [1,2].
Computational analysis of the complex amorphization-crystallization dynamics in phase change memory devices with large geometries is important to understand the evolution of phase distributions and temperature profiles during programming of these devices. In this work, we conduct electrothermal finite element simulations of reset operation on a large Ge2Sb2Te5 (GST) cell using the framework we have developed in COMSOL multiphysics [3]-[9] and analyze the complex dynamics of amorphization, nucleation and growth during electrical stress. We input voltage waveforms measured from electrical characterization of on-oxide GST line cells with bottom metal contact pads and Si3N4 capping. A 2D polycrystalline model of the experimentally measured cells (~360 nm wide, ~400 nm long and ~50 nm thick) is constructed in the simulations. Access devices are modeled using the spice models. The simulations capture some of the interplay between changes in the device resistance due to heating and phase changes and current fluctuations.
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- Award ID(s):
- 1710468
- NSF-PAR ID:
- 10105356
- Date Published:
- Journal Name:
- Materials Research Society symposia proceedings
- ISSN:
- 0272-9172
- Page Range / eLocation ID:
- EP08.08.02
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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In this paper, we propose and demonstrate electrical switching of a 4% tungsten-doped Ge2Sb2Te5(W-GST) pixel in a lateral configuration without the need for an auxiliary resistive heater. The phase transition between an amorphous and poly-crystalline state is achieved by Joule heating directly through the 4
μ m × 4μ m × 350 nm active volume of the chalcogenide phase change pixel. While undoped GST would be challenging to switch in a lateral configuration due to very large resistance in the amorphous state, W-GST allows for switching at reasonable voltage levels. The pixel temperature profile is simulated using finite element analysis methods to identify the pulse parameters required for a successful electrical actuation. Experimentally, a 1550 nm light source is used for in-situ optical reflection measurements in order to verify the crystallization and re-amorphization of the pixel. As a result of the W doping, we identify volatile and non-volatile regimes with respect to bias voltage and pulse width during crystallization. During amorphization, we observe irreversible material failure after one complete cycle using in-situ optical monitoring, which can be attributed to a migration or segregation process. These results provide a promising path toward electrically addressed devices that are suitable for optical applications requiring amplitude modulation in a reflective geometry, such as spatial light modulators. -
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Herein, a finite element simulation framework for phase‐change memory devices that simultaneously solves for current continuity, electrothermal heating, and crystallization–amorphization dynamics using electrothermal models and dynamic material parameters that are functions of electric field and temperature is described. In this latest model, an electric field‐ and temperature‐dependent electrical conductivity model of stable amorphous Ge2Sb2Te5(GST) obtained from experiments performed on GST line cells to study Read, Reset, and Set operations of mushroom cells is incorporated. The effects of current polarity, heater height, Reset pulse rise and fall times, access device configuration, and ambient temperature are analyzed. The simulation results predict a 2x change in Reset current requirements with different current polarity due to thermoelectric effects. Heater height plays a significant role in thermal losses; ≈16% decrease in Reset current for 4x increase in the heater height is obtained. Increase in the ambient temperature results in a linear decrease in the Reset power required to achieve the same Reset/Set resistance contrast.
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We characterized resistance drift in phase change memory devices in the 80 K to 300 K temperature range by performing measurements on 20 nm thick, ∼70–100 nm wide lateral Ge2Sb2Te5(GST) line cells. The cells were amorphized using 1.5–2.5 V pulses with ∼50–100 ns duration leading to ∼0.4–1.1 mA peak reset currents resulting in amorphized lengths between ∼50 and 700 nm. Resistance drift coefficients in the amorphized cells are calculated using constant voltage measurements starting as fast as within a second after amorphization and for 1 h duration. Drift coefficients range between ∼0.02 and 0.1 with significant device-to-device variability and variations during the measurement period. At lower temperatures (higher resistance states) some devices show a complex dynamic behavior, with the resistance repeatedly increasing and decreasing significantly over periods in the order of seconds. These results point to charge trapping and de-trapping events as the cause of resistance drift.
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Phase-change memory (PCM) materials are being developed for faster, non-volatile & high-density memory that can facilitate more efficient computation as well as data storage. The materials used for these PCM devices are usually chalcogenides that can be switched between their amorphous and crystalline phases thus producing orders of magnitude difference in the electrical resistivity [1, 2]. The operation of such devices is limited by elemental segregation and void formation, which occurs as a result of the extensive cycling. After crystallization, the structure gradually transforms from fcc to hexagonal. In the present work, we are studying these different phase changes in-situ as they occur in PCM materials basically using TEM imaging. The aim is to correlate device modeling and electrical characterization in order to improve the models and enable accurate, predictive simulations. The thin film materials and devices can be directly deposited onto Protochips devices, allowing controlled temperature changes while imaging in the TEM. Although the temperature change rate achievable is too slow as compared to the fastest PCM-device operation, these rates can provides valuable insights into the various property changes in the material and phase transformations as well. Both a Cs-image corrected Titan ETEM and a Tecnai F30 have been used for this study. The ETEM is equipped with a K2 direct electron detector camera allowing high-speed video recording of these PCM materials.more » « less
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Accepted Manuscript1.0
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