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Title: Effects of Silicide Inclusion Shape on Thermal Transport of Silicon-Based Nanowires and Nanocomposites for Thermoelectric Applications
Award ID(s):
1807825
PAR ID:
10107564
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Page Range / eLocation ID:
348 to 354
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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