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Title: Functionally Graded Adhesives Using Radiation Curing
Adhesively bonded joints contain stress concentrations at geometric and material discontinuities within the joint, causing the joint to be inefficient. This study investigates a method to grade the material properties of an adhesive across the bondline to have a soft, flexible adhesive near the stress concentration and a stiff, strong adhesive elsewhere. Theoretical studies and a few experiemental studies have shown an that the load is distributed more evenly along the joint and strength is increased. Adhesive gradation is achieved through a secondary crosslinking system in the adhesive which is activated via radiation. After an adhesive is initially cured, the joint can be exposed to varying levels of radiation to grade the properties. Initial results demonstrate the ability to grade stiffness using radiation shielding, and final results will demonstrate the application in an adhesively bonded joint.  more » « less
Award ID(s):
1663502
PAR ID:
10138513
Author(s) / Creator(s):
; ; ;
Date Published:
Journal Name:
AIAA Scitech 2020 Forum
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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