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Abstract Controlling adhesion on demand is essential for many manufacturing and assembly processes such as microtransfer printing. Among various strategies, pneumatics‐controlled switchable adhesion is efficient and robust but currently still suffers from challenges in miniaturization and high energy cost. In this paper, a novel way to achieve tunable adhesion using low pressure by inducing sidewall buckling in soft hollow pillars (SHPs) is introduced. It is shown that the dry adhesion of these SHPs can be changed by more than two orders of magnitude (up to 151×) using low activating pressure (≈−10 or ≈20 kPa). Large enough negative pressure triggers sidewall buckling while positive pressure induces sidewall bulging, both of which can significantly change stress distribution at the bottom surface to facilitate crack initiation and reduce adhesion therein. It is shown that a single SHP can be activated by a micropump to manipulate various lightweight objects with different curvatures and surface textures. Here, it is also demonstrated that an array of SHPs can realize selective pick‐and‐place of an array of objects. These demonstrations illustrate the robustness, simplicity, and versatility of these SHPs with highly tunable dry adhesion.
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Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing
Automated handling of microscale objects is essential for manufacturing of next-generation electronic systems. Yet, mechanical pick-and-place technologies cannot manipulate smaller objects whose surface forces dominate over gravity, and emerging microtransfer printing methods require multidirectional motion, heating, and/or chemical bonding to switch adhesion. We introduce soft nanocomposite electroadhesives (SNEs), comprising sparse forests of dielectric-coated carbon nanotubes (CNTs), which have electrostatically switchable dry adhesion. SNEs exhibit 40-fold lower nominal dry adhesion than typical solids, yet their adhesion is increased >100-fold by applying 30 V to the CNTs. We characterize the scaling of adhesion with surface morphology, dielectric thickness, and applied voltage and demonstrate digital transfer printing of films of Ag nanowires, polymer and metal microparticles, and unpackaged light-emitting diodes.
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- PAR ID:
- 10142203
- Date Published:
- Journal Name:
- Science Advances
- Volume:
- 5
- Issue:
- 10
- ISSN:
- 2375-2548
- Page Range / eLocation ID:
- eaax4790
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1126/sciadv.aax4790
