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Title: Scaling-up Atomically Thin Coplanar Semiconductor–Metal Circuitry via Phase Engineered Chemical Assembly
Award ID(s):
1719875
PAR ID:
10146338
Author(s) / Creator(s):
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Date Published:
Journal Name:
Nano Letters
Volume:
19
Issue:
10
ISSN:
1530-6984
Page Range / eLocation ID:
6845 to 6852
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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