Scaling-up Atomically Thin Coplanar Semiconductor–Metal Circuitry via Phase Engineered Chemical Assembly
- Award ID(s):
- 1719875
- PAR ID:
- 10146338
- Date Published:
- Journal Name:
- Nano Letters
- Volume:
- 19
- Issue:
- 10
- ISSN:
- 1530-6984
- Page Range / eLocation ID:
- 6845 to 6852
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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