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Title: Low-cost and low-topography fabrication of multilayer interconnections for microfluidic devices
Award ID(s):
1711708 1720499
PAR ID:
10154705
Author(s) / Creator(s):
; ;
Publisher / Repository:
IOP Publishing
Date Published:
Journal Name:
Journal of Micromechanics and Microengineering
Volume:
30
Issue:
7
ISSN:
0960-1317
Page Range / eLocation ID:
Article No. 077001
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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