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Title: Thermal-Aware Design and Flow for FPGA Performance Improvement
Award ID(s):
1826967 1730158
PAR ID:
10169648
Author(s) / Creator(s):
;
Date Published:
Journal Name:
IEEE/ACM Design Automation and Test in Europe (DATE) Conference 2019
Page Range / eLocation ID:
342 to 347
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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