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Title: Electromigration in Bi-crystal pure Sn solder joints: Elucidating the role of grain orientation
Award ID(s):
1763128
PAR ID:
10176193
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
Journal of Alloys and Compounds
Volume:
818
Issue:
C
ISSN:
0925-8388
Page Range / eLocation ID:
152918
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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