Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
- Award ID(s):
- 1809439
- Publication Date:
- NSF-PAR ID:
- 10177848
- Journal Name:
- Nature Communications
- Volume:
- 11
- Issue:
- 1
- ISSN:
- 2041-1723
- Sponsoring Org:
- National Science Foundation