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Title: Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage
Award ID(s):
1809439
NSF-PAR ID:
10177848
Author(s) / Creator(s):
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Date Published:
Journal Name:
Nature Communications
Volume:
11
Issue:
1
ISSN:
2041-1723
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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