Modeling of the thermodiffusion-induced filament formation in TiN/TaOx/TiN resistive switching devices
- Award ID(s):
- 1905648
- PAR ID:
- 10345130
- Date Published:
- Journal Name:
- Physical review applied
- Volume:
- 17
- Issue:
- 5
- ISSN:
- 2331-7019
- Page Range / eLocation ID:
- 054040
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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