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Title: An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs
Award ID(s):
1909027 1910075
PAR ID:
10178091
Author(s) / Creator(s):
; ; ;
Date Published:
Journal Name:
Proceedings of the 2019 on Great Lakes Symposium on VLSI
Page Range / eLocation ID:
439 to 444
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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