Chen, Liang, Tan, Sheldon X.-D., Sun, Zeyu, Peng, Shaoyi, Tang, Min, and Mao, Junfa. Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. Retrieved from https://par.nsf.gov/biblio/10195468. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28.2 Web. doi:10.1109/TVLSI.2019.2940197.

Chen, Liang, Tan, Sheldon X.-D., Sun, Zeyu, Peng, Shaoyi, Tang, Min, & Mao, Junfa. Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 28 (2). Retrieved from https://par.nsf.gov/biblio/10195468. https://doi.org/10.1109/TVLSI.2019.2940197

Chen, Liang, Tan, Sheldon X.-D., Sun, Zeyu, Peng, Shaoyi, Tang, Min, and Mao, Junfa. "Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires". IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (2). Country unknown/Code not available. https://doi.org/10.1109/TVLSI.2019.2940197. https://par.nsf.gov/biblio/10195468.

@article{osti_10195468,
place = {Country unknown/Code not available}, title = {Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires}, url = {https://par.nsf.gov/biblio/10195468}, DOI = {10.1109/TVLSI.2019.2940197}, abstractNote = {}, journal = {IEEE Transactions on Very Large Scale Integration (VLSI) Systems}, volume = {28}, number = {2}, author = {Chen, Liang and Tan, Sheldon X.-D. and Sun, Zeyu and Peng, Shaoyi and Tang, Min and Mao, Junfa}, }